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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Failures of Ag Wire Bonding ICs in Real-world Applications:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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Resistive Failure Localization of Electronic Components by ..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
7
The Typical Failure Analysis Of Ceramic Packaged Devices:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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Investigation on failures of plastic package devices with u..:
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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Combined methods for analyzing the nonvisual failures of a ..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
10