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2024 International Conference on Electronics Packaging (ICEP) ,
1
Carbon/Nitrogen Dual-Doped inP-Type Silicon Hard Mask for W..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Novel Single and Co-Ion Implantation Induced Backside Etch ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
3
Alignment and Transfer of Silver Nanowire Arrays onto Uncon..:
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2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) ,
10
Boron Ion Implantation-Induced Embedded Layers for Ultra-Th..:
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2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) ,
11
Using a Mixed Solvent to Improve the Morphology of Thin Fil..:
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2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) ,
13
Reusable Detector of ZnO-based Transistor in Floating Gate ..:
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2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) ,
14