E-LIB Suche - Ergebnisse für: Chen-Ming Kuo

1

An Empirical Study on the Learning Experiences and Outcomes..:

Chen, Ming-Kuo ; Chien, Hsin-Nan ; Liu, Ruo-Lan
Applied System Innovation. 6 (2023) 1 - p. 23 , 2023

Link: https://doi.org/10.3390/..

2

High Temperature Tensile Behavior of Directionally Solidifi..:

Bor, Hui Yun ; Wei, Chao Nan ; Yeh, An Chou...
Materials Science Forum. 783-786 (2014) - p. 1153-1158 , 2014

Link: https://doi.org/10.4028/..

3

Effects of Cooling Rates after Solution Heat Treatment on t..:

Chiou, Mau Sheng ; Yeh, An Chou ; Jian, Sheng Rui.
Materials Science Forum. 788 (2014) - p. 549-553 , 2014

Link: https://doi.org/10.4028/..

4

Comparison of the Mechanical Properties of Hastelloy X Mate..:

Wu, Shih Jeh ; Du, Chao Wei ; Kuo, Chen Ming
Materials Science Forum. 638-642 (2010) - p. 2499-2504 , 2010

Link: https://doi.org/10.4028/..

5

Three New Species and Six Newly Recorded Species of Jumping..:

Chen, Kuo-Ming ; Lin, Tai-Yu ; Ueng, Yih-Tsong
Natural Resources. 12 (2021) 9 - p. 290-320 , 2021

Link: https://doi.org/10.4236/..

6

Lifetime Maximization for Uplink Transmission in UAV-Enable..:

, In: 2019 IEEE Wireless Communications and Networking Conference (WCNC),

Chen, Kuo-Ming ; Chang, Tsung-Hui ; Lee, Ta-Sung - p. 1-6 , 2019

Link: https://doi.org/10.1109/..

7

Thermal–mechanical optimization of a novel nanocomposite-fi..:

Cheng, Hsien-Chie ; Hsieh, Kun-Yu ; Chen, Kuo-Ming
Microelectronics Reliability. 51 (2011) 4 - p. 826-836 , 2011

Link: https://doi.org/10.1016/..

8

A longest prefix first search tree for IP lookup:

Wuu, Lih-Chyau ; Liu, Tzong-Jye ; Chen, Kuo-Ming
Computer Networks. 51 (2007) 12 - p. 3354-3367 , 2007

Link: https://doi.org/10.1016/..

9

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu c..:

Lai, Yi-Shao ; Chen, Kuo-Ming ; Kao, Chin-Li..
Microelectronics Reliability. 47 (2007) 8 - p. 1273-1279 , 2007

Link: https://doi.org/10.1016/..

10

Thermal resistance analysis and validation of flip chip PBG..:

Chen, Kuo-Ming ; Houng, Kuo-Hsiung ; Chiang, Kuo-Ning
Microelectronics Reliability. 46 (2006) 2-4 - p. 440-448 , 2006

Link: https://doi.org/10.1016/..

11

Effects of pre-bump probing and bumping processes on eutect..:

Chen, Kuo-Ming ; Wu, J.D. ; Chiang, Kuo-Ning
Microelectronics Reliability. 46 (2006) 12 - p. 2104-2111 , 2006

Link: https://doi.org/10.1016/..

12

Current crowding-induced electromigration in SnAg3.0Cu0.5 m..:

Chiang, Kuo Ning ; Lee, Chien Chen ; Lee, Chang Chun.
Applied Physics Letters. 88 (2006) 7 - p. , 2006

Link: https://doi.org/10.1063/..

13

The effects of simultaneous exposure to methyl ethyl ketone..:

Chang, Ho-Yuan ; Yun, Yuan-Der ; Yu, Yi-Chun...
Toxicology Letters. 155 (2005) 3 - p. 385-395 , 2005

Link: https://doi.org/10.1016/..

14

Impact of probing procedure on flip chip reliability:

Chen, Kuo-Ming ; Chiang, Kuo-Ning
Microelectronics Reliability. 43 (2003) 1 - p. 123-130 , 2003

Link: https://doi.org/10.1016/..

15

Coplanarity analysis and validation of PBGA and T2-BGA pack..:

Chen, Kuo-Ming ; Horng, Kuo-Hsiung ; Chiang, Kuo-Ning
Finite Elements in Analysis and Design. 38 (2002) 12 - p. 1165-1178 , 2002

Link: https://doi.org/10.1016/..