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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Improvement of Power and Signal Integrity through Layer Ass..:
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2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
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Enhanced Power and Signal Integrity Through Layout Optimiza..:
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) ,
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Miniaturized Quarter-Wavelength Resonator for Common-Mode F..:
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) ,
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