E-LIB Suche - Ergebnisse für: Cheng, Hsien-Chie

1

Chipping-induced fracture investigation of glass interposer..:

Lee, Chang-Chun ; Chuang, Jui-Chang ; Lee, Chien-Han.
Surface and Coatings Technology. 489 (2024) - p. 131097 , 2024

2

Power Cycling Modeling and Lifetime Evaluation of SiC Power..:

Cheng, Hsien-Chie ; Syu, Ji-Yuan ; Wang, He-Hong...
IEEE Transactions on Device and Materials Reliability. 24 (2024) 1 - p. 142-153 , 2024

Link: https://doi.org/10.1109/..

3

Solder Joint Lifetime Characterization of a SiC Power MOSFE..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Wang, He-Hong ; Cheng, Hsien-Chie ; Liu, Yan-Cheng... - p. 1-2 , 2024

Link: https://doi.org/10.23919..

4

Solder die attach lifetime characterization of SOT-227 powe..:

Cheng, Hsien-Chie ; Hsu, Chih-Wei
Journal of Mechanics. 39 (2023) - p. 518-528 , 2023

Link: https://doi.org/10.1093/..

5

Effective Macroscopic Thermomechanical Characterization of ..:

Cheng, Hsien-Chie ; Jhu, Wen-You
Materials. 16 (2023) 23 - p. 7491 , 2023

Link: https://doi.org/10.3390/..

6

Development and Performance Evaluation of Integrated Hybrid..:

Cheng, Hsien-Chie ; Liu, Yan-Cheng ; Lin, Hsin-Han...
Micromachines. 14 (2023) 7 - p. 1356 , 2023

Link: https://doi.org/10.3390/..

7

Development of ANN-Based Warpage Prediction Model for FCCSP..:

Cheng, Hsien-Chie ; Ma, Chia-Lin ; Liu, Yang-Lun
Micromachines. 14 (2023) 7 - p. 1325 , 2023

Link: https://doi.org/10.3390/..

8

A DFT Characterization of Structural, Mechanical, and Therm..:

Cheng, Hsien-Chie ; Yu, Ching-Feng
Metals. 12 (2022) 11 - p. 1852 , 2022

Link: https://doi.org/10.3390/..

9

Estimation of Switching Transients and Power Losses of SiC-..:

, In: 2022 International Conference on Electronics Packaging (ICEP),

Liu, Yan-Cheng ; Cheng, Hsien-Chie ; Lin, Hsin-Han... - p. 159-160 , 2022

Link: https://doi.org/10.23919..

10

A Study of Factors Affecting Process-Induced Warpage Behavi..:

, In: 2021 International Conference on Electronics Packaging (ICEP),

Chen, Yi-Huang ; Tai, Ling-Ching ; Liu, Yan-Cheng. - p. 105-106 , 2021

Link: https://doi.org/10.23919..

11

Transient Electro-Thermal Coupled Modeling of Three-Phase P..:

Cheng, Hsien-Chie ; Lin, Siang-Yu ; Liu, Yan-Cheng
Materials. 14 (2021) 18 - p. 5427 , 2021

Link: https://doi.org/10.3390/..

12

Theoretical and Experimental Investigation of Warpage Evolu..:

Cheng, Hsien-Chie ; Tai, Ling-Ching ; Liu, Yan-Cheng
Materials. 14 (2021) 17 - p. 4816 , 2021

Link: https://doi.org/10.3390/..

13

Mechanical property assessment of black phosphorene nanotub..:

Chen, Wen-Hwa ; Yu, Ching-Feng ; Chen, I-Chu.
Computational Materials Science. 133 (2017) - p. 35-44 , 2017

Link: https://doi.org/10.1016/..

14

Assessing Ink Transfer Performance of Gravure-Offset Fine-..:

Cheng, Hsien-Chie ; Chen, You-Wei ; Chen, Wen-Hwa..
Journal of Electronic Materials. 47 (2017) 3 - p. 1832-1846 , 2017

Link: https://doi.org/10.1007/..

15

Theoretical assessment of structural, mechanical, and therm..:

Chen, Wen-Hwa ; Yu, Ching-Feng ; Cheng, Hsien-Chie
Solid State Sciences. 68 (2017) - p. 10-18 , 2017

Link: https://doi.org/10.1016/..