E-LIB Suche - Ergebnisse für: Cheng, Yi-Lung

1

Synergistic enhancement of adhesion and electromigration re..:

Fang, Jau-Shiung ; Su, Ting-Hsun ; Cheng, Yi-Lung.
Microelectronics Reliability. 158 (2024) - p. 115427 , 2024

Link: https://doi.org/10.1016/..

2

Process optimization of titanium self-aligned silicide form..:

Gau, In-Chi ; Chang, Yao-Wen ; Chen, Giin-Shan..
Solid-State Electronics. 215 (2024) - p. 108879 , 2024

Link: https://doi.org/10.1016/..

3

The feasibility of an ultrathin dual-barrier scheme to inhi..:

Hsiao, Chien-Nan ; Pan, Yen-Chang ; Chen, Wei-Chun...
Surfaces and Interfaces. 51 (2024) - p. 104703 , 2024

Link: https://doi.org/10.1016/..

4

Understanding electromigration failure behaviors of narrow ..:

Fang, Jau-Shiung ; Chen, Giin-Shan ; Chang, Chin-Chia...
Journal of Alloys and Compounds. 970 (2024) - p. 172591 , 2024

Link: https://doi.org/10.1016/..

5

Comparison of Barrier Efficiency for Self-Assembled Monolay..:

Cheng, Yi-Lung ; Lee, Chih-Yen ; Chen, Giin-Shan.
ECS Journal of Solid State Science and Technology. 12 (2023) 12 - p. 123009 , 2023

Link: https://doi.org/10.1149/..

6

Layer-by-layer deposition of breakdown-strengthened Co(Ni) ..:

Fang, Jau-Shiung ; Chen, Kun-Huang ; Cheng, Yi-Lung.
Materials Chemistry and Physics. 296 (2023) - p. 127222 , 2023

Link: https://doi.org/10.1016/..

7

Reliability Characteristics of Metal-Insulator-Semiconducto..:

Cheng, Yi-Lung ; Peng, Wei-Fan ; Huang, Chi-Jia..
Molecules. 28 (2023) 3 - p. 1134 , 2023

Link: https://doi.org/10.3390/..

8

Comparison of Self-Assembled Monolayers Using 3-Aminopropyl..:

Cheng, Yi-Lung ; Kao, Joe ; Zhang, Hao-Wei.
Coatings. 13 (2023) 3 - p. 507 , 2023

Link: https://doi.org/10.3390/..

9

Dual near-zero-thickness sealing for the strengthening of c..:

Chen, Giin-Shan ; Pan, Yen-Chang ; Chen, Wei-Chun...
Applied Surface Science. 609 (2023) - p. 155387 , 2023

Link: https://doi.org/10.1016/..

10

Comparison of Cobalt Integration with Various Dielectric Ma..:

Cheng, Yi-Lung ; Huang, Hong-Chang ; Peng, Wei-Fan..
Coatings. 13 (2023) 10 - p. 1818 , 2023

Link: https://doi.org/10.3390/..

11

Reinforcement in electromigration reliability of Cu interco..:

Fang, Jau-Shiung ; Lee, Ching-En ; Cheng, Yi-Lung.
Journal of Alloys and Compounds. 951 (2023) - p. 169974 , 2023

Link: https://doi.org/10.1016/..

12

Comparison of Precursors for Self-Assembled Monolayers as C..:

Cheng, Yi-Lung ; Lee, Chih-Yen ; Chen, Giin-Shan.
ECS Journal of Solid State Science and Technology. , 2023

Link: https://doi.org/10.1149/..

13

Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the ..:

Cheng, Yi-Lung ; Wang, Kai-Hsieh ; Lee, Chih-Yen..
Materials. 16 (2023) 4 - p. 1452 , 2023

Link: https://doi.org/10.3390/..

14

Enhancement of Electromigration Reliability of Electroless-..:

Chen, Giin-Shan ; Lee, Ching-En ; Cheng, Yi-Lung...
Journal of The Electrochemical Society. 169 (2022) 8 - p. 082519 , 2022

Link: https://doi.org/10.1149/..

15

Comparison of Self-Assembled Monolayers on SiO2 and Porous ..:

Cheng, Yi-Lung ; Peng, Wei-Fan ; Lee, Chih-Yen..
Coatings. 12 (2022) 7 - p. 926 , 2022

Link: https://doi.org/10.3390/..