Chengwei Huang
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1

Research on the properties of high thermal conductivity sta..:

, In: 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE),
Hongjun, Gao ; Zhiduo, Shan ; Xiaohang, Wang... - p. 1-4 , 2022
 
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2

High-Order Markov Random Fields and Their Applications in C..:

Zhipeng, Jiang ; Chengwei, Huang
Cybernetics and Information Technologies.  15 (2015)  4 - p. 50-57 , 2015
 
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3

Modified Perona-Malik Equation and Computer Simulation for ..:

Feng, Zheng Jian ; Chengwei, Huang ; Ji, Zhang
The Open Mechanical Engineering Journal.  8 (2014)  1 - p. 37-41 , 2014
 
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5

Multichannel Speech Enhancement Based on Neural Beamforming..:

Pang, Cong ; Fan, Jingjie ; Shen, Qifan...
IEEE Transactions on Cognitive and Developmental Systems.  16 (2024)  3 - p. 973-983 , 2024
 
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6

Design and synthesis of bifunctional conjugated microporous..:

Mohamed, Mohamed Gamal ; Hu, Huan-Yu ; Santhoshkumar, S....
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  680 (2024)  - p. 132675 , 2024
 
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7

Selective online model updating in hybrid simulation of a f..:

Sepulveda, Claudio ; Cheng, Mao ; Becker, Tracy...
Earthquake Engineering & Structural Dynamics.  53 (2024)  10 - p. 3071-3092 , 2024
 
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11

A Theoretical Solution of Deformation and Stress Calculatio..:

Li, Haibin ; Liu, Bo ; Li, Li..
KSCE Journal of Civil Engineering.  28 (2024)  6 - p. 2399-2408 , 2024
 
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13

Temperature effects on hard carbon derived from sawdust as ..:

Liu, Zhi-Ting ; Hsieh, Tzu-Hsien ; Huang, Cheng-Wei..
Journal of the Taiwan Institute of Chemical Engineers.  154 (2024)  - p. 104889 , 2024
 
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14

Residual Fusion Probabilistic Knowledge Distillation for Sp..:

Cheng, Jiaming ; Liang, Ruiyu ; Zhou, Lin...
IEEE/ACM Transactions on Audio, Speech, and Language Processing.  32 (2024)  - p. 2680-2691 , 2024
 
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15

Research and Development of Automatic Leakage Inspection Sy..:

, In: Multidimensional Signals, Augmented Reality and Information Technologies; Smart Innovation, Systems and Technologies,
Zhou, Wen ; Mao, Kun ; Hua, Shengbin... - p. 339-352 , 2024
 
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