Cheong, Kuan Yew
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5

Multiple P-Type SiC Micro-Island as Junction Termination Ex..:

Wang, Xinyu ; Yuan, Dengwen ; Lai, Lingling...
IEEE Electron Device Letters.  45 (2024)  8 - p. 1405-1408 , 2024
 
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7

Review on interfacial bonding enhancement of inorganic thin..:

Lim, Ruo Xuen ; Khor, Meow Siang ; Cheong, Kuan Yew
International Journal of Adhesion and Adhesives.  129 (2024)  - p. 103579 , 2024
 
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9

Influence of post fabrication annealing on device performan..:

Luo, Xin ; Cui, Peng ; Linewih, Handoko...
Journal of Physics and Chemistry of Solids.  187 (2024)  - p. 111870 , 2024
 
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13

High-Performance Diamond Phototransistor with Gate Controll..:

Ge, Lei ; Li, Bin ; Li, Guo...
The Journal of Physical Chemistry Letters.  14 (2023)  2 - p. 592-597 , 2023
 
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15

Investigation of incorporating CeO2 seed layer for overgrow..:

Milad, Saad ; Nsar, Ali ; Hassan, Zainuriah...
Journal of Materials Science: Materials in Electronics.  34 (2023)  9 - p. , 2023
 
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