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Cherman, Vladimir
28  results:
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1

Block level and package level thermal assessment for back s..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lofrano, Melina ; Oprins, Herman ; Cherman, Vladimir... - p. 1036-1043 , 2024
Link: https://doi.org/10.1109/..
 
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2

Experimentally Validated Thermal Modeling Prediction for BE..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chang, Xinyue ; Oprins, Herman ; Vermeersch, Bjorn... - p. 498-505 , 2024
Link: https://doi.org/10.1109/..
 
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3

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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4

Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Je..:

Elsinger, Georg ; Oprins, Herman ; Cherman, Vladimir...
Fluids.  9 (2024)  3 - p. 69 , 2024
Link: https://doi.org/10.3390/..
 
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5

Towards accurate temperature prediction in BEOL for reliabi..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Lofrano, Melina ; Oprins, Herman ; Chang, Xinyue... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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6

Calibrated fast thermal calculation and experimental charac..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Chang, Xinyue ; Oprins, Herman ; Lofrano, Melina... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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7

Thermal and Mechanical characterization of embedded PTCQ pa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Weis, Gerald ; Schwarz, Timo ; Cherman, Vladimir.. - p. 537-541 , 2023
Link: https://doi.org/10.1109/..
 
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8

Liquid jet impingement cooling of high-performance interpos..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Oprins, H. ; Wei, Tiwei ; Cherman, Vladimir. - p. 1-10 , 2023
Link: https://doi.org/10.1109/..
 
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9

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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10

Heat transfer and pressure drop correlations for direct on-..:

Wei, Tiwei ; Oprins, Herman ; Fang, Liang...
International Journal of Heat and Mass Transfer.  182 (2022)  - p. 121865 , 2022
Link: https://doi.org/10.1016/..
 
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11

Confined IMCs for low temperature and high throughput D2W b..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Derakhshandeh, Jaber ; La Tulipe, Douglas Charles ; Capuz, Giovanni... - p. 131-132 , 2022
Link: https://doi.org/10.23919..
 
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12

Thermal Aspects of Silicon Photonic Interposer Packages:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Oprins, Herman ; Ban, Yoojin ; Cherman, Vladimir. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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13

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Capuz, Giovanni ; Cherman, Vladimir... - p. 617-622 , 2020
Link: https://doi.org/10.1109/..
 
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14

Process development and characterization of 3D multi-die st..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Gerets, Carine ; Derakhshandeh, Jaber ; Bex, Pieter... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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15

3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hy..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Oprins, Herman ; Cherman, Vladimir ; Webers, Tomas... - p. 219-228 , 2020
Link: https://doi.org/10.1109/..
 
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Friede von Versailles 1919