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2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA) ,
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ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based A..:
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2024 IEEE 42nd VLSI Test Symposium (VTS) ,
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OpenROAD and CircuitOps: Infrastructure for ML EDA Research..:
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2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC) ,
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Exploiting 2.5D/3D Heterogeneous Integration for AI Computi..:
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2023 24th International Symposium on Quality Electronic Design (ISQED) ,
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Analysis of Pattern-dependent Rapid Thermal Annealing Effec..:
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2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) ,
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Invited Paper: 2023 ICCAD CAD Contest Problem C: Static IR ..:
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2023 IEEE 15th International Conference on ASIC (ASICON) ,
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Benchmarking Heterogeneous Integration with 2.5D/3D Interco..:
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2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) ,
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Frequency-Domain Transient Electromigration Analysis Using ..:
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Proceedings of the 2023 International Symposium on Physical Design ,
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Recent Progress in the Analysis of Electromigration and Str..:
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2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) ,
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Invited Paper: CircuitOps: An ML Infrastructure Enabling Ge..:
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2022 ACM/IEEE 4th Workshop on Machine Learning for CAD (MLCAD) ,
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From Global Route to Detailed Route: ML for Fast and Accura..:
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Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD ,
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XT-PRAGGMA: Crosstalk Pessimism Reduction Achieved with GPU..:
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2022 ACM/IEEE 4th Workshop on Machine Learning for CAD (MLCAD) ,
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