Chiang, Chia-Wen
7316  results:
Search for persons X
?
2

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
 
?
4

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Yang, Shih-Chi ; Ong., Jia-Juen ; Tran, Dinh-Phuc... - p. 13-14 , 2023
 
?
6

Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrysta..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chiang, Chia-Wen. - p. 679-684 , 2022
 
?
8

Fabrication and Characterization of Wafer Level Three-Dimen..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
?
 
?
11

Email security level classification of imbalanced data usin..:

Huang, Jen-Wei ; Chiang, Chia-Wen ; Chang, Jia-Wei
Engineering Applications of Artificial Intelligence.  75 (2018)  - p. 11-21 , 2018
 
?
15

The electrical characterizations of glass interposer for in..:

, In: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, Ching-Kuan ; Wang, Jen-Chun ; Lin, Yu-Min... - p. 336-339 , 2015
 
1-15