Chiong, Kenny
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1

Effect of Reflow on Solder Joint in Low Temperature SnBi So..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chiong, Kenny ; Sutiono, Sylvia ; Kumar, B. Senthil... - p. 221-226 , 2023
 
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2

Voids Reduction in Fine Pitch SiP Assembly Through Optimiza..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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7

Pharmacokinetic serum concentrations of VRC01 correlate wit..:

Kelly E. Seaton ; Yunda Huang ; Shelly Karuna...
http://www.sciencedirect.com/science/article/pii/S235239642300155X.  , 2023
 
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