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Proceedings of the 28th Asia and South Pacific Design Automation Conference ,
1
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
2
An Approximated Model of Boltzmann Transport Equation for N..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
3
Temperature-to-Power Mapping for Smartphones:
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Proceedings of the 24th Asia and South Pacific Design Automation Conference ,
4
Multi-angle bended heat pipe design using x-architecture ro..:
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Proceedings of the 24th Asia and South Pacific Design Automation Conference ,
5
Phone-nomenon : a system-level thermal simulator for han..:
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2019 24th Asia and South Pacific Design Automation Conference (ASP-DAC) ,
6
Multi-Angle Bended Heat Pipe Design Using X-Architecture Ro..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Learning Based Mesh Generation for Thermal Simulation in Ha..:
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Proceedings of the 36th International Conference on Computer-Aided Design ,
8
Thermal modeling and design on smartphones with heat pipe c..:
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