E-LIB Suche - Ergebnisse für: Chiu, Ryan

1

Difference Frequency of EMI Shielding Solutions for SiP Mod..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Tsai, Mike ; Chiu, Ryan ; Lin, James... - p. 211-214 , 2023

Link: https://doi.org/10.1109/..

2

Design of Single Miniaturized Dielectric Resonant Antenna f..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Lai, Chia-Chu ; Lin, Sam ; Shih, Teny... - p. 1820-1824 , 2023

Link: https://doi.org/10.1109/..

3

Clinical and radiographic risk indicators for decompressive..:

Sadeh, Morteza ; Patel, Saavan ; Souter, John...
Interdisciplinary Neurosurgery. 27 (2022) - p. 101390 , 2022

Link: https://doi.org/10.1016/..

4

Double Side SiP of Structure Strength Analysis for 5G and W..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Tsai, Mike ; Li, Wynn ; Ding, Ethan... - p. 18-23 , 2022

Link: https://doi.org/10.1109/..

5

Socioeconomic Inequities in the Surgical Management of Moya..:

Chiu, Ryan ; Chaker, Anisse ; McGuire, Laura Stone...
World Neurosurgery. 155 (2021) - p. e188-e195 , 2021

Link: https://doi.org/10.1016/..

6

Highly Integrated Assembly Processes Solutions for Double-S..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),

Ma, Bo-Hao ; Ho, David ; Wang, Yu-Po... - p. 1-5 , 2020

Link: https://doi.org/10.1109/..

7

Concurrent Versus Staged Procedures for Ventriculoperitonea..:

Rosinski, Clayton L. ; Behbahani, Mandana ; Geever, Brett...
World Neurosurgery. 143 (2020) - p. e648-e655 , 2020

Link: https://doi.org/10.1016/..

8

EMI Shielding Technology in 5G RF System in Package Module:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Li, Jay ; Tsai, Mike ; Chiu, Ryan... - p. 931-937 , 2020

Link: https://doi.org/10.1109/..

9

A Rare Case of Synchronous Double Cardiac Leiomyosarcoma in..:

Ogami, Takuya ; Zimmermann, Eric ; Chiu, Ryan..
JACC: Case Reports. 2 (2020) 5 - p. 828-829 , 2020

Link: https://doi.org/10.1016/..

10

Advanced Antenna Integration of 3D System in Package Soluti..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Tsai, Mike ; Chiu, Ryan ; He, Eric... - p. 1-6 , 2019

Link: https://doi.org/10.23919..

11

Innovative Packaging Solutions of 3D Integration and System..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Lian, Frank ; Wang, David ; Chiu, Ryan.. - p. 515-518 , 2019

Link: https://doi.org/10.1109/..

12

EMI Shielding Solutions for RF SiP Assembly:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Su, James PoYuan ; Wang, Yu Po ; Tsai, Mike. - p. 46-50 , 2019

Link: https://doi.org/10.1109/..

13

Innovative EMI Shielding Solutions on Advanced SiP Module f..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Tsai, Mike ; Chiu, Ryan ; He, Eric... - p. 601-607 , 2019

Link: https://doi.org/10.1109/..

14

Characteristics of work-related spine injury in the USA: a ..:

Jiang, Sam H. ; Nico, Elsa ; Bhaskara, Mounika...
Acta Neurochirurgica. 165 (2023) 10 - p. 3097-3106 , 2023

Link: https://doi.org/10.1007/..

15

Factors correlated with neuropathic pain among industrial w..:

Nguyen, Tham Thi ; Nguyen, Huong Van ; Vu, Hai Minh...
Frontiers in Public Health. 11 (2023) - p. , 2023

Link: https://doi.org/10.3389/..