E-LIB Suche - Ergebnisse für: Chiu, Yingta

1

Critical Challenges with Copper Hybrid Bonding for Chip-to-..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Zhou, Wei ; Kwon, Michael ; Chiu, Yingta... - p. 336-341 , 2023

2

Light enhanced direct Cu bonding for advanced electronic as..:

Liang, Sin-Yong ; Song, Jenn-Ming ; Huang, Shang-Kun...
Journal of Materials Science: Materials in Electronics. 29 (2018) 16 - p. 14144-14150 , 2018

Link: https://doi.org/10.1007/..

3

Softening of Micro Sn Electrodeposit by Polyethylene Glycol..:

Chiu, Tsung-Chieh ; Chiu, Ying-Ta ; Lin, Kwang-Lung
ECS Journal of Solid State Science and Technology. 7 (2018) 3 - p. P109-P113 , 2018

Link: https://doi.org/10.1149/..

4

Enhanced Cu-to-Cu direct bonding by controlling surface phy..:

Chiang, Po-Hao ; Liang, Sin-Yong ; Song, Jenn-Ming...
Japanese Journal of Applied Physics. 56 (2017) 3 - p. 035503 , 2017

Link: https://doi.org/10.7567/..

5

Effects of electromagnetic radiation exposure on direct Cu ..:

, In: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D),

Song, Jenn-Ming ; Liang, Sin-Yong ; Chiang, Po-Hao... - p. 43-43 , 2017

Link: https://doi.org/10.23919..

6

Current induced segregation of intermetallic compounds in t..:

Chen, Chiao-Wen ; Chiu, Tsung-Chieh ; Chiu, Ying-Ta..
Intermetallics. 85 (2017) - p. 117-124 , 2017

Link: https://doi.org/10.1016/..

7

Electro-dissolution of the Bi second phase in Sn5Bi solder ..:

Chiu, Tsung-Chieh ; Chiu, Ying-Ta ; Lin, Kwang-Lung
Materials Letters. 160 (2015) - p. 309-313 , 2015

Link: https://doi.org/10.1016/..

8

Low-temperature Cu-to-Cu bonding using silver nanoparticles..:

Li, Wen-Hua ; Lin, Pei-Syuan ; Chen, Chen-Ni...
Materials Science and Engineering: A. 613 (2014) - p. 372-378 , 2014

Link: https://doi.org/10.1016/..

9

Investigation of electromigration reliability of redistribu..:

Kao, Chin-Li ; Chen, Tei-Chen ; Lai, Yi-Shao.
Microelectronics Reliability. 54 (2014) 11 - p. 2471-2478 , 2014

Link: https://doi.org/10.1016/..

10

The influence of Pd on the interfacial reactions between th..:

Lin, Yu-Wei ; Ke, Wun-Bin ; Wang, Ren-You...
Surface and Coatings Technology. 231 (2013) - p. 599-603 , 2013

Link: https://doi.org/10.1016/..

11

Ball Impact Reliability of Zn-Sn High-Temperature Solder Jo..:

Song, Jenn-Ming ; Lin, Meng-Ju ; Hsieh, Kun-Hung...
Journal of Electronic Materials. 42 (2013) 9 - p. 2813-2821 , 2013

Link: https://doi.org/10.1007/..

12

Electrorecrystallization of Metal Alloy:

Chiu, Ying-Ta ; Lin, Kwang-Lung ; Wu, Albert T....
Journal of Alloys and Compounds. 549 (2013) - p. 190-194 , 2013

Link: https://doi.org/10.1016/..

13

Dissolution of Sn in a SnPb solder bump under current stres..:

Chiu, Ying-Ta ; Lin, Kwang-Lung ; Lai, Yi-Shao
Journal of Applied Physics. 111 (2012) 4 - p. , 2012

Link: https://doi.org/10.1063/..

14

Influence of trace alloying elements on the ball impact tes..:

Song, Jenn-Ming ; Liu, Yao-Ren ; Lai, Yi-Shao..
Microelectronics Reliability. 52 (2012) 1 - p. 180-189 , 2012

Link: https://doi.org/10.1016/..

15

The Pd distribution and Cu flow pattern of the Pd-plated Cu..:

Lin, Yu-Wei ; Wang, Ren-You ; Ke, Wun-Bin...
Materials Science and Engineering: A. 543 (2012) - p. 152-157 , 2012

Link: https://doi.org/10.1016/..