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Choi, Gwang-Mun
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1

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
Link: https://doi.org/10.1109/..
 
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2

Reliability of Indium Solder Joints using a Laser-Assisted ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jung, Ji Eun ; Eom, Yong-Sung ; Joo, Jiho... - p. 2237-2243 , 2024
Link: https://doi.org/10.1109/..
 
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3

Anisotropic Solder Paste (ASP) Material Solution for Laser ..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Jang, Ki-Seok ; Eom, Yong-Sung ; Choi, Gwang-Mun... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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4

Mechanical Reliability Assessment of a Flexible Package Fab..:

Le, Xuan-Luc ; Le, Xuan-Bach ; Hwangbo, Yuhwan...
Micromachines.  14 (2023)  3 - p. 601 , 2023
Link: https://doi.org/10.3390/..
 
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5

Micro-structure analysis of solder joint using room tempera..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moon, Yoon Hwan ; Joo, Jiho ; Choi, Gwang-Mun... - p. 01-06 , 2023
Link: https://doi.org/10.1109/..
 
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6

Laser-Assisted Bonding with Compression (LABC) based Tiling..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1385-1389 , 2023
Link: https://doi.org/10.1109/..
 
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7

Process Window of Mini-LED Display Panel Packaging using La..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Eom, Yong-Sung ; Choi, Gwang-Mun ; Jang, Ki-Seok... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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8

30‐5: Late‐News Paper: Development of a highly reliable Min..:

Joo, Jiho ; Choi, Gwang-Mun ; Lee, Chanmi...
SID Symposium Digest of Technical Papers.  54 (2023)  1 - p. 433-436 , 2023
Link: https://doi.org/10.1002/..
 
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9

Interconnection Reliability of Mini LEDs for Display Applic..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kye, In-Seok ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1184-1191 , 2022
Link: https://doi.org/10.1109/..
 
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10

Transparent and flexible hybrid cover window film: Hard coa..:

Lee, Yung ; Lee, Hyunhwan ; Im, Hyeon-Gyun...
Composites Part B: Engineering.  247 (2022)  - p. 110336 , 2022
Link: https://doi.org/10.1016/..
 
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11

Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 198-203 , 2022
Link: https://doi.org/10.1109/..
 
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12

Mini LED array transferred onto a flexible substrate using ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Joo, Jiho ; Choi, Gwang-Mun ; Lee, Chanmi... - p. 619-624 , 2022
Link: https://doi.org/10.1109/..
 
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13

Epoxy based Solder Paste for Flexible Substrate with Laser ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Jang, Ki-Seok ; Eom, Yong-Sung ; Choi, Gwang-Mun... - p. 28-30 , 2022
Link: https://doi.org/10.1109/..
 
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14

74‐4: Development of Flexible Full‐Color Mini‐LED Display U..:

Joo, Jiho ; Choi, Gwang-Mun ; Lee, Chanmi...
SID Symposium Digest of Technical Papers.  53 (2022)  1 - p. 1005-1008 , 2022
Link: https://doi.org/10.1002/..
 
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15

Siloxane Hybrid Material-Encapsulated Highly Robust Flexibl..:

Lee, Han Eol ; Lee, Daewon ; Lee, Tae-Ik...
ACS Applied Materials & Interfaces.  14 (2022)  24 - p. 28258-28269 , 2022
Link: https://doi.org/10.1021/..
 
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