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2024 International Conference on Electronics Packaging (ICEP) ,
4
Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding:
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Proceedings of the CHI Conference on Human Factors in Computing Systems ,
5
FLUID-IoT : Flexible and Fine-Grained Access Control in Sha..:
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2024 International Conference on Electronics Packaging (ICEP) ,
6
Effect of Evaporated and Sputtered Au Nanolayers on Cu Surf..:
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2024 International Conference on Electronics Packaging (ICEP) ,
11
Optimization of O2 Plasma Treatment on Cu Surface for Hybri..:
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GLOBECOM 2023 - 2023 IEEE Global Communications Conference ,
14
Power-Efficient Indoor Localization Using Adaptive Channel-..:
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2023 IEEE Wireless Communications and Networking Conference (WCNC) ,
15