Search for persons
X
?
2024 International Conference on Electronics Packaging (ICEP) ,
1
Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
3
Effect of Evaporated and Sputtered Au Nanolayers on Cu Surf..:
, In:
?
Proceedings of the CHI Conference on Human Factors in Computing Systems ,
5
FLUID-IoT : Flexible and Fine-Grained Access Control in Sha..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
11