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Chong, Chai Tai
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1

Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Rotaru, Mihai ; Xiangyu, Wang... - p. 2017-2023 , 2024
Link: https://doi.org/10.1109/..
 
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2

Design and Analysis of 3D Heterogeneous Chiplet Stack for R..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Rotaru, Mihai Dragos ; Tiwari, Shashank ; Castillou, Paul.. - p. 1486-1492 , 2023
Link: https://doi.org/10.1109/..
 
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3

Board level FEA reliability and stress modeling for chip-to..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Mandal, Rathin ; Chong, Chai Tai - p. 1735-1738 , 2023
Link: https://doi.org/10.1109/..
 
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4

Process and Integration Challenges for Via Last TSV (from t..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wang, Xiangyu ; Rotaru, Mihai Dragos ; Haitao, Yu... - p. 116-119 , 2023
Link: https://doi.org/10.1109/..
 
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5

3D Stacking of Heterogeneous Chiplets on Modified FOWLP Pla..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Long, Lau Boon ; Siang, Sharon Lim Pei... - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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6

Heterogeneous Integration for Chiplets on FOWLP Development..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Ho, Soon Wee ; Choong, Chong Ser.. - p. 655-659 , 2022
Link: https://doi.org/10.1109/..
 
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7

Development of Two-Tier FO-WLP AiPs for Automotive Radar Ap..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ho, Soon Wee ; Hsiang-Yao, Hsiao ; Long, Lau Boon... - p. 1376-1383 , 2022
Link: https://doi.org/10.1109/..
 
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8

Via-Last TSV (From Top) Fabrication on a LNA SOI Wafer for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Wang, Xiangyu ; Rotaru, Mihai Dragos ; Haitao, Yu.. - p. 119-123 , 2022
Link: https://doi.org/10.1109/..
 
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9

Thermal Aging and Ball Shear Characterization of SAC-X Sold..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Choong, Chong Ser ; Siang, Sharon Lim Pei. - p. 321-325 , 2020
Link: https://doi.org/10.1109/..
 
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10

An Automatic Chip-Package Co-Design Flow for Multi-core Neu..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lan, Jingjing ; Nambiar, Vishnu P. ; Sabapathy, Rheeshaalaen... - p. 77-80 , 2020
Link: https://doi.org/10.1109/..
 
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11

Design, Process and Reliability of Face-up 2-layer molded F..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Teck Guan, Lim ; Yong, Han... - p. 19-24 , 2020
Link: https://doi.org/10.1109/..
 
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12

Double Mold Antenna in Package for 77 GHz Automotive Radar:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Boon, Soh Siew ; Long, Lau Boon... - p. 257-261 , 2020
Link: https://doi.org/10.1109/..
 
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13

3D FOWLP Integration:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Guan, Lim Teck ; Soon Wee Ho, David ; Chong, Chai Tai. - p. 1728-1735 , 2020
Link: https://doi.org/10.1109/..
 
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14

FOWLP RF Passive Circuit Designs for 77GHz MIMO radar appli..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Mei, Sun ; Guan, Lim Teck ; Peng, Xie Dan.. - p. 445-448 , 2020
Link: https://doi.org/10.1109/..
 
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15

A Study to Reduce Molding Film Defects During Vacuum Lamina..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Ho, David ; Ps, Sharon Lim. - p. 130-134 , 2020
Link: https://doi.org/10.1109/..
 
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