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Choong Chong, Ser
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1

Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Pho..:

, In: 2024 IEEE Silicon Photonics Conference (SiPhotonics),
Li, Xin ; Nair Gourikutty, Sajay Bhuvanendran ; Wu, Jiaqi... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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2

Process Challenges in Thin Wafers Fabrication with Double S..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kumar, Mishra Dileep ; Nagendra Sekhar, Vasarla ; Rao, B.S.S. Chandra.. - p. 614-619 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Wu, Jiaqi ; Lim, Teck Guan... - p. 1398-1403 , 2024
Link: https://doi.org/10.1109/..
 
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4

Indium-based Flip-chip Interconnect for Cryogenic Packaging:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Hongyu, Li ; Choong, Chong Ser... - p. 970-973 , 2023
Link: https://doi.org/10.1109/..
 
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5

Evaluation of Low Temperature Inorganic Dielectric Material..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Kumar, Mishra Dileep ; Nagendra Sekhar, Vasarla ; Choong, Chong Ser... - p. 354-358 , 2023
Link: https://doi.org/10.1109/..
 
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6

Evaluation of C2W hybrid bonding performance with SiO2/SiCN..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tippabhotla, Sasi Kumar ; Ji, Lin ; Choong, Chong Ser - p. 1053-1058 , 2023
Link: https://doi.org/10.1109/..
 
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7

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
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8

Investigation of Void-free Chip-to-Chip Bonding Methods for..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yeo, Yi Xuan ; Leong Ching Wai, Eva ; Chen, Daniel Ssu-Han. - p. 869-872 , 2023
Link: https://doi.org/10.1109/..
 
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9

3D Defect Detection and Metrology of HBMs using Semi-Superv..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pahwa, Ramanpreet Singh ; Chang, Richard ; Jie, Wang... - p. 943-950 , 2023
Link: https://doi.org/10.1109/..
 
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10

The laser cavity electric connection line with SnAg solder ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chi, Ting Ta ; Li, Zhenyu ; Yu, Haitao... - p. 12-15 , 2023
Link: https://doi.org/10.1109/..
 
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11

Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sekhar, V. N. ; Mishra, Dileep Kumar ; Choong, Chong Ser. - p. 589-593 , 2022
Link: https://doi.org/10.1109/..
 
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12

Establishment of Highly Dense Wire Bonding with Insulated A..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jaafar, Norhanani Binte ; Choong, Chong Ser - p. 352-356 , 2022
Link: https://doi.org/10.1109/..
 
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13

Process Development of Via Formation by Laser Drilling on I..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Cereno, Daniel Ismael ; Choong, Chong Ser ; Hsiang-Yao, Hsiao - p. 401-404 , 2022
Link: https://doi.org/10.1109/..
 
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14

Yield Improvement in Chip to Wafer Hybrid Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choong Chong, Ser ; Cereno Daniel, Ismael ; Lim Pei Siang, Sharon... - p. 1982-1986 , 2022
Link: https://doi.org/10.1109/..
 
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15

Evaluation of Polymer Materials for Hybrid Bonding Applicat..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mishra, Dileep Kumar ; Sekhar, V. N. ; Choong, Chong Ser. - p. 357-360 , 2022
Link: https://doi.org/10.1109/..
 
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