Search for persons
X
?
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ,
9
Advanced 2.5D Heterogeneous Integrated Platform Using Flexi..:
, In:
?
2019 IEEE International Electron Devices Meeting (IEDM) ,
13
Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:
, In:
?
2019 IEEE 10th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) ,
14