E-LIB Suche - Ergebnisse für: Chou, Tzu-Ting

1

Statistical Analysis of Contact Stiffness for Shaft-Bearing..:

Tsai, Jhy-Cherng ; Chou, Tzu-Ting ; Chang, Che-Kang
Procedia CIRP. 92 (2020) - p. 45-50 , 2020

Link: https://doi.org/10.1016/..

2

The Architecture Design and Novel Material Selection for Im..:

Song, Rui-Wen ; Chou, Tzu-Ting ; Fleshman, Collin Jordan..
ECS Transactions. 90 (2019) 1 - p. 35-40 , 2019

Link: https://doi.org/10.1149/..

3

Low thermal budget bonding for 3D-package by collapse-free ..:

Chou, Tzu-Ting ; Song, Rui-Wen ; Chen, Hao.
Materials Chemistry and Physics. 238 (2019) - p. 121887 , 2019

Link: https://doi.org/10.1016/..

4

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni..:

Chou, Tzu-Ting ; Song, Rui-Wen ; Chen, Wei-Yu.
Materials Letters. 235 (2019) - p. 180-183 , 2019

Link: https://doi.org/10.1016/..

5

Investigating the Effect of Ag Content on Mechanical Proper..:

Chen, Hao ; Chou, Tzu-Ting ; Fleshman, Collin.
Journal of Electronic Materials. 48 (2019) 10 - p. 6866-6871 , 2019

Link: https://doi.org/10.1007/..

6

Improving thermal shock response of interfacial IMCs in Sn–..:

Chou, Tzu-Ting ; Fleshman, Collin Jordon ; Chen, Hao.
Journal of Materials Science: Materials in Electronics. 30 (2018) 3 - p. 2342-2350 , 2018

Link: https://doi.org/10.1007/..

7

Refinement of the β-Sn Grains in Ni-Doped Sn-3.0Ag-0.5Cu So..:

Chou, Tzu-Ting ; Chen, Wei-Yu ; Fleshman, Collin Jordon.
Journal of Electronic Materials. 47 (2018) 5 - p. 2911-2919 , 2018

Link: https://doi.org/10.1007/..

8

Functional magnetic nanoparticles–assisted electrochemical ..:

Lee, Cheng-Yu ; Wu, Li-Ping ; Chou, Tzu-Ting.
Sensors and Actuators B: Chemical. 257 (2018) - p. 672-677 , 2018

Link: https://doi.org/10.1016/..

9

Applying SEM, EPMA and EBSD Analytic Techniques on Solder J..:

Chou, Tzu-Ting ; Song, Rui-Wen ; Duh, Jenq-Gong
Microscopy and Microanalysis. 24 (2018) S1 - p. 618-619 , 2018

Link: https://doi.org/10.1017/..

10

The variation of grain structure and the enhancement of she..:

Fleshman, Collin ; Chen, Wei-Yu ; Chou, Tzu-Ting..
Materials Chemistry and Physics. 189 (2017) - p. 76-79 , 2017

Link: https://doi.org/10.1016/..

11

The investigation of interfacial and crystallographic obser..:

Lee, Christine Jill ; Chen, Wei-Yu ; Chou, Tzu-Ting...
Journal of Materials Science: Materials in Electronics. 26 (2015) 12 - p. 10055-10061 , 2015

Link: https://doi.org/10.1007/..

12

Retarding the Cu–Sn and Ag–Sn intermetallic compounds by ap..:

Chen, Wei-Yu ; Chou, Tzu-Ting ; Tu, Wei...
Journal of Materials Science: Materials in Electronics. 26 (2015) 4 - p. 2357-2362 , 2015

Link: https://doi.org/10.1007/..

13

Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu– x Zn mic..:

Chen, Wei-Yu ; Tu, Wei ; Chang, Hsiang-Ching..
Materials Letters. 134 (2014) - p. 184-186 , 2014

Link: https://doi.org/10.1016/..

14

Direct observation of single-atom defects in monolayer two-..:

Chen, Ying ; Chou, Tzu-Chieh ; Fang, Ching-Hsing...
Scientific Reports. 14 (2024) 1 - p. , 2024

Link: https://doi.org/10.1038/..

15

Ultralow Auger-Assisted Interlayer Exciton Annihilation in ..:

Cai, Cheng-Syuan ; Lai, Wei-Yan ; Liu, Po-Hsuan...
Nano Letters. 24 (2024) 9 - p. 2773-2781 , 2024

Link: https://doi.org/10.1021/..