Chu, Ngo Minh
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1

Synthesis of β‐MoO3 nanowhiskers from core/shell molybdenum..:

Chu, Ngo Minh ; Duy Hieu, Nguyen ; Do, Thi Mai Dung...
International Journal of Applied Ceramic Technology.  18 (2021)  3 - p. 889-901 , 2021
 
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2

Preparation of boron nanoparticles by pulsed discharge of c..:

Hieu, Nguyen Duy ; Chu, Ngo Minh ; Tokoi, Yoshinori...
Japanese Journal of Applied Physics.  59 (2020)  SC - p. SCCC05 , 2020
 
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3

Synthesis of metastable monoclinic beta molybdenum trioxide..:

Chu, Ngo Minh ; Hieu, Nguyen Duy ; Do, Thi Mai Dung...
Japanese Journal of Applied Physics.  59 (2019)  SC - p. SCCC02 , 2019
 
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4

Synthesis of molybdenum carbide nanoparticles using pulsed ..:

Chu, Ngo Minh ; Hieu, Nguyen Duy ; Do, Dung Thi Mai...
Journal of the American Ceramic Society.  102 (2019)  12 - p. 7108-7115 , 2019
 
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5

Hydration process of β-MoO3 powder prepared by pulsed wire ..:

Ngo, Chu Minh ; Hieu, Nguyen Duy ; Do, Thi Mai Dung...
Japanese Journal of Applied Physics.  61 (2022)  SB - p. SB1018 , 2022
 
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7

Synthesis of β‐MoO3 whiskers by the thermal evaporation met..:

Ngo, Chu Minh ; Nguyen, Hieu Duy ; Saito, Nobuo...
Journal of the American Ceramic Society.  105 (2021)  3 - p. 1622-1628 , 2021
 
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8

Delamination of Metallized AlN Substrate under Thermal Cycl..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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9

Effect of Thermal Cycle Temperature Gap on Thermal Fatigue ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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10

Analysis of thermal strain of metallized silicon nitride su..:

Ngo, Minh Chu ; Miyazaki, Hiroyuki ; Hirao, Kiyoshi.
International Journal of Applied Ceramic Technology.  21 (2023)  2 - p. 1032-1041 , 2023
 
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11

Measurement of Thermal Strain of Metallized Silicon Nitride..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
 
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13

Fracture toughness evaluation of silicon nitride from micro..:

Furushima, Ryoichi ; Maruyama, Yutaka ; Nakashima, Yuki...
Journal of the American Ceramic Society.  106 (2022)  2 - p. 817-821 , 2022
 
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