Search for persons
X
?
2024 IEEE European Test Symposium (ETS) ,
1
New Standard-under-Development for Chiplet Interconnect Tes..:
, In:
?
2024 IEEE 42nd VLSI Test Symposium (VTS) ,
3
IEEE Std P3405: New Standard-under-Development for Chiplet ..:
, In:
?
2023 IEEE International 3D Systems Integration Conference (3DIC) ,
5
Effective and Efficient Test and Diagnosis Pattern Generati..:
, In:
?
2023 IEEE International Test Conference in Asia (ITC-Asia) ,
6
Generating Test Patterns for Chiplet Interconnects: Achievi..:
, In:
?
2023 IEEE 41st VLSI Test Symposium (VTS) ,
7
Effective and Efficient Testing of Large Numbers of Inter-D..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
8
A Novel Polymer-Based Ultra-High Density Bonding Interconne..:
, In:
?
2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) ,
9
A Thermal Quorum Sensing Scheme for Enhancement of Integrat..:
, In:
?
2020 57th ACM/IEEE Design Automation Conference (DAC) ,
11
A 90nm 103.14 TOPS/W Binary-Weight Spiking Neural Network C..:
, In:
?
Proceedings of the 57th ACM/EDAC/IEEE Design Automation Conference ,
12
A 90nm 103.14 TOPS/W binary-weight spiking neural network C..:
, In:
?
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
13
Hybrid Fan-out Package for Vertical Heterogeneous Integrati..:
, In:
1-15
