Chui, D L K
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2

Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Hong Miao ; Chen, Gim Guan ; Chui, K.-J. - p. 951-954 , 2022
 
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3

Process Development and Integration for Wafer-to-Wafer Hybr..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Li, Hongyu ; Ji, Hong Miao ; Chen, Gim Guan... - p. 01-04 , 2022
 
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Advanced System in Package Enabled by Wafer Level Heterogen..:

, In: 2022 International Electron Devices Meeting (IEDM),
Bhattacharya, S. ; Lim, T. G. ; Ho, D.... - p. 3.1.1-3.1.4 , 2022
 
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Automated Analysis of AFM Data of High-Density Cu Pad for F..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Jiakai ; Ng, Yong Chyn ; Mishra, Dileep K.. - p. 837-840 , 2022
 
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8

Hidradenitis suppurativa: A review of post-operative outcom..:

Elliott, J. ; Chui, K. ; Rosa, N...
Journal of Plastic, Reconstructive & Aesthetic Surgery.  74 (2021)  3 - p. 644-710 , 2021
 
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9

The Prognostic Role Of Stress Echocardiography In Cad-rad G..:

Kam, K. ; Chui, K. ; Cheung, L..
Journal of Cardiovascular Computed Tomography.  14 (2020)  3 - p. S29 , 2020
 
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10

Disparities in prevalence of metabolic syndrome: A cross-se..:

Joshi, C ; Thanikachalam, M ; OI Bermudez.
European Journal of Public Health.  30 (2020)  Supplement_5 - p. , 2020
 
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11

High Aspect Ratio (>10:1) Via-Middle TSV with High-k Dielec..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Chui, K. ; Wang, I-Ting ; Che, Faxing.. - p. 721-724 , 2019
 
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13

Accelerometer assessment of physical activity and its assoc..:

Corcoran, Michael P. ; Chui, K. K. H. ; White, D. K....
The journal of nutrition, health & aging.  20 (2015)  7 - p. 752-758 , 2015
 
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14

Medical student performed pocket-sized ultrasound echocardi..:

Yan, B. ; Wong, H. ; Fok, J....
Heart, Lung and Circulation.  24 (2015)  - p. S350 , 2015
 
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