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Chui, King Jien
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1

Two-Phase Liquid Cooling for High-Power Microelectronics vi..:

Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 397-405 , 2024
Link: https://doi.org/10.1109/..
 
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2

Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Coolin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 1964-1968 , 2023
Link: https://doi.org/10.1109/..
 
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3

Development of Crossflow Manifold for Two-Phase Liquid Cool..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 1012-1016 , 2023
Link: https://doi.org/10.1109/..
 
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4

High-Performance Amplifier Package Design for Heterogenous ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lim, Teck Guan ; Zho, Lin ; Tippabhotla, Sasi Kumar... - p. 1838-1843 , 2023
Link: https://doi.org/10.1109/..
 
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5

Design and Development of Manifolds for Parallel Flow and C..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu... - p. 880-884 , 2022
Link: https://doi.org/10.1109/..
 
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6

Multi-Layer High-K Gate Stack Materials for Low Dit 4H-SiC ..:

Bera, Lakshmi Kanta ; Singh, Navab ; Chen, Ze Yu...
Materials Science Forum.  1062 (2022)  - p. 528-532 , 2022
Link: https://doi.org/10.4028/..
 
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7

Via-Last TSV (From Top) Fabrication on a LNA SOI Wafer for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Wang, Xiangyu ; Rotaru, Mihai Dragos ; Haitao, Yu.. - p. 119-123 , 2022
Link: https://doi.org/10.1109/..
 
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8

Resistive Random Access Memory Device Physics and Array Arc..:

, In: Emerging Non-volatile Memory Technologies,
Zhuo, Victor Yiqian ; Chen, Zhixian ; Chui, King Jien - p. 319-343 , 2021
Link: https://doi.org/10.1007/..
 
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9

Endurance and Variability Control for Analog Switching in D..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Wang, Weijie ; Song, Wendong ; Liu, Jen-Chieh... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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10

Analog switching characteristics in TiW/Al2O3/Ta2O5/Ta RRAM..:

Song, Wendong ; Wang, Weijie ; Lee, Hock Koon...
Applied Physics Letters.  115 (2019)  13 - p. , 2019
Link: https://doi.org/10.1063/..
 
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11

Thin-Film Magnetic Inductor for Integrated Power Management:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Muthukumaraswamy, Annamalai Arasu ; Chui, King Jien ; Lim, Wei Yi... - p. 1485-1490 , 2017
Link: https://doi.org/10.1109/..
 
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12

Passive Devices Fabrication on FOWLP and Characterization f..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Wang, Chunmei ; Chui, King Jien ; Wang, Xiangyu... - p. 312-318 , 2017
Link: https://doi.org/10.1109/..
 
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13

Through silicon via (TSV) scallop smoothening technique:

, In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
Wong, Goon Heng ; Chui, King Jien ; Lau, Guan Kian.. - p. 676-678 , 2014
Link: https://doi.org/10.1109/..
 
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14

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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15

Design and Fabrication of 2.5D Cryogenic Interposer With In..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, HongYu ; Chui, King-Jien ; Kiat Goh, Simon Chun... - p. 458-463 , 2024
Link: https://doi.org/10.1109/..
 
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