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Ciofi, Ivan
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1

A pragmatic network-aware paradigm for system-level electro..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Zahedmanesh, Houman ; Roussel, Philippe ; Ciofi, Ivan. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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2

Towards accurate temperature prediction in BEOL for reliabi..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Lofrano, Melina ; Oprins, Herman ; Chang, Xinyue... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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3

Exploring the Benefits of Cryogenic Temperatures for Co and..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Tierno, Davide ; Ciofi, Ivan ; Pedreira, Olalla Varela.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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4

Challenges for Interconnect Reliability : From Element t..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Varela Pedreira, Olalla ; Zahedmanesh, Houman ; Ding, Youqi.. - p. 106 ff. , 2023
Link: https://dl.acm.org/doi/1..
 
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5

Ruthenium Metallization and Via Prefill for Electromigratio..:

, In: 2023 IEEE International Integrated Reliability Workshop (IIRW),
Esposto, Simone ; Sisto, Giuliano ; Ciofi, Ivan... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Resistance modeling of short-range connections: impact of c..:

Tierno, Davide ; Vega-Gonzalez, Victor ; Esposto, Simone.
Japanese Journal of Applied Physics.  62 (2023)  SC - p. SC1034 , 2023
Link: https://doi.org/10.35848..
 
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7

Thermal analysis of advanced back-end-of-line structures an..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Chang, Xinyue ; Oprins, Herman ; Lofrano, Melina... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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8

Evaluation of BEOL scaling boosters for sub-2nm using enhan..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Farokhnejad, Anita ; Esposto, Simone ; Ciofi, Ivan... - p. 136-138 , 2022
Link: https://doi.org/10.1109/..
 
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9

Integration scheme and 3D RC extractions of three-level sup..:

Gupta, Anshul ; Bömmels, Jürgen ; Saad, Yves..
Microelectronic Engineering.  191 (2018)  - p. 20-24 , 2018
Link: https://doi.org/10.1016/..
 
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10

Design considerations for the mechanical integrity of airga..:

Zahedmanesh, Houman ; Gonzalez, Mario ; Ciofi, Ivan...
Microelectronics Reliability.  59 (2016)  - p. 102-107 , 2016
Link: https://doi.org/10.1016/..
 
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11

Stress analysis of airgaps under process-induced thermo-mec..:

Zahedmanesh, Houman ; Gonzalez, Mario ; Ciofi, Ivan...
Microelectronic Engineering.  156 (2016)  - p. 70-77 , 2016
Link: https://doi.org/10.1016/..
 
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12

Atomic Layer Deposition of Ruthenium with TiN Interface for..:

Wen, Liang Gong ; Roussel, Philippe ; Pedreira, Olalla Varela...
ACS Applied Materials & Interfaces.  8 (2016)  39 - p. 26119-26125 , 2016
Link: https://doi.org/10.1021/..
 
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13

Sealed ultra low-k organosilica films with improved electri..:

Goethals, Frederik ; Levrau, Elisabeth ; Pollefeyt, Glenn...
Journal of Materials Chemistry C.  1 (2013)  25 - p. 3961 , 2013
Link: https://doi.org/10.1039/..
 
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14

Ultra-low-k cyclic carbon-bridged PMO films with a high che..:

Goethals, Frederik ; Ciofi, Ivan ; Madia, Oreste...
Journal of Materials Chemistry.  22 (2012)  17 - p. 8281 , 2012
Link: https://doi.org/10.1039/..
 
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15

Self-Controlled Constant-Current Temperature Stress for Tri..:

Ciofi, Ivan ; Mannarino, Manuel ; Li, Yunlong..
ECS Transactions.  41 (2012)  43 - p. 113-123 , 2012
Link: https://doi.org/10.1149/..
 
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