Ciou, Yun-Ting
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1

Software-Defined Ultra-reliable Industrial Traffic Mechanis..:

, In: 2021 IEEE International Conference on Consumer Electronics (ICCE),
Lee, Chao-Hsien ; Ciou, Yun-Ting - p. 1-2 , 2021
 
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3

Analysis of Breakdown-Voltage Increase on SiC Junction Barr..:

Jin, Fu-Yuan ; Chen, Po-Hsun ; Hung, Wei-Chun...
IEEE Transactions on Electron Devices.  70 (2023)  1 - p. 191-195 , 2023
 
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4

Multitask Record for Badminton Match:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Guo, Jing-Ming ; Huang, Yu-Shun ; Chang, Ting-Yu... - p. 2048-2052 , 2023
 
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5

A Wireless Urine Detection System and Platform with Power-E..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Lee, Shuenn-Yuh ; Lee, Hao-Yun ; Ciou, Ding-Siang... - p. 246-247 , 2022
 
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6

Abnormal trend in hot carrier degradation with fin profile ..:

Kuo, Ting-Tzu ; Chen, Ying-Chung ; Chang, Ting-Chang...
Semiconductor Science and Technology.  37 (2022)  4 - p. 045010 , 2022
 
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7

Abnormal hump in low temperature in SiGe devices with silic..:

Huang, Wei-Chen ; Chen, Po-Hsun ; Lin, Chih-Yang...
Journal of Physics D: Applied Physics.  54 (2021)  41 - p. 415105 , 2021
 
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8

Abnormal Positive Bias Temperature Instability Induced by D..:

Jin, Fu-Yuan ; Chang, Ting-Chang ; Lin, Chien-Yu...
IEEE Journal of the Electron Devices Society.  7 (2019)  - p. 897-901 , 2019
 
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12

Analysis of the Slot on a Dual-Band Antenna:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
 
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13

Small Wireless Module Consisting of Two Highly Isolated MIM..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
 
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14

Influence of Molecular Symmetry and Terminal Substituents o..:

Huang, Yi-Fan ; Chung, Chin-Lung ; Prakoso, Suhendro Purbo...
ACS Applied Materials & Interfaces.  12 (2020)  36 - p. 40572-40580 , 2020
 
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15

Influences of Structural Modification of S,N-Hexacenes on t..:

Huang, Yi-Fan ; Wang, Chun-Kai ; Lai, Bo-Han...
ACS Applied Materials & Interfaces.  11 (2019)  24 - p. 21756-21765 , 2019
 
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