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2024 IEEE International Reliability Physics Symposium (IRPS) ,
2
BEOL tip-to-tip dielectric reliability characterization usi..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
4
De-Coupling Thermo-Migration from Electromigration Using a ..:
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49th European Conference on Optical Communications (ECOC 2023) ,
5
50 Gbps vertical separate absorption charge multiplication ..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
6
Impact of via geometry and line extension on via-electromig..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
9
Thermomigration-induced void formation in Cu-interconnects ..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
12
Novel Low Thermal Budget CMOS RMG: Performance and Reliabil..:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
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