E-LIB Suche - Ergebnisse für: Croes, K.

1

Impact of work function metal stacks on the performance and..:

Franco, J. ; Arimura, H. ; Brus, S....
Solid-State Electronics. 216 (2024) - p. 108929 , 2024

Link: https://doi.org/10.1016/..

2

BEOL tip-to-tip dielectric reliability characterization usi..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Fang, Y. ; Lesniewska, A. ; Ciofi, I.... - p. 1-7 , 2024

Link: https://doi.org/10.1109/..

3

Strategic collaboration to address nitrous oxide challenges..:

Gernez, E. ; Alpdemir, M. ; Anseeuw, K....
Clinica Chimica Acta. 558 (2024) - p. 118243 , 2024

Link: https://doi.org/10.1016/..

4

De-Coupling Thermo-Migration from Electromigration Using a ..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Pedreira, O. Varela ; Ding, Y. ; Coenen, D.... - p. 1-5 , 2024

Link: https://doi.org/10.1109/..

5

50 Gbps vertical separate absorption charge multiplication ..:

, In: 49th European Conference on Optical Communications (ECOC 2023),

Tsiara, A. ; Berciano, M. ; Yudistira, D.... - p. None , 2023

Link: https://doi.org/10.1049/..

6

Impact of via geometry and line extension on via-electromig..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),

Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

7

Novel Low Thermal Budget CMOS RMG: Performance and Reliabil..:

Franco, J. ; Arimura, H. ; de Marneffe, J.-F....
IEEE Transactions on Electron Devices. 70 (2023) 12 - p. 6658-6664 , 2023

Link: https://doi.org/10.1109/..

8

Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch I..:

Fang, Yu ; Ciofi, I. ; Roussel, Ph. J....
IEEE Transactions on Electron Devices. 70 (2023) 8 - p. 4332-4337 , 2023

Link: https://doi.org/10.1109/..

9

Thermomigration-induced void formation in Cu-interconnects ..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),

Ding, Y. ; Pedreira, O. Varela ; Lofrano, M.... - p. 1-7 , 2023

Link: https://doi.org/10.1109/..

10

Suicidal sodium nitrite intoxication: a case report focusin..:

Andelhofs, D. ; Van Den Bogaert, W. ; Lepla, B...
Forensic Science, Medicine and Pathology. , 2023

Link: https://doi.org/10.1007/..

11

A framework for combined simulations of electromigration in..:

Saleh, A. S. ; Croes, K. ; Ceric, H...
Journal of Applied Physics. 134 (2023) 13 - p. , 2023

Link: https://doi.org/10.1063/..

12

Novel Low Thermal Budget CMOS RMG: Performance and Reliabil..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Franco, J. ; Arimura, H. ; de Marneffe, J.-F.... - p. 1-2 , 2023

Link: https://doi.org/10.23919..

13

Electromigration-induced void evolution and failure of Cu/S..:

Ceric, H. ; Zahedmanesh, H. ; Croes, K...
Journal of Applied Physics. 133 (2023) 10 - p. , 2023

Link: https://doi.org/10.1063/..

14

Experimental Study Of Interface & Bulk Defectivity In Ultra..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Saini, N. ; Tierno, D. ; Croes, K.. - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

15

A combined modelling approach to design test structures to ..:

Ding, Y. ; Lofrano, M. ; Varela Pedreira, O....
Microelectronics Reliability. 138 (2022) - p. 114632 , 2022

Link: https://doi.org/10.1016/..