Dag, Sefa
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1

GAA Technology Innovations for 2nm Logic node and Beyond:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
 
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2

Next Generation Gate-all-around Device Design for Continued..:

, In: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Vyas, Pratik B. ; Zhao, Charisse ; Dag, Sefa... - p. 57-60 , 2023
 
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3

Plasma Modeling Framework on Dielectric Surfaces in Hybrid ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Dag, Sefa ; Jiang, Liu ; Hung, Raymond... - p. 211-215 , 2023
 
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4

Tungsten Interconnect Resistance Reduction Enabling Energy ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Thareja, Gaurav ; Pal, Ashish ; Ma, Quan... - p. 1-4 , 2023
 
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5

Development of Copper Thermal Coefficient For Low Temperatu..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Dag, Sefa ; Liu, Ming ; Jiang, Liu... - p. 342-349 , 2023
 
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6

BEOL Interconnect Innovation: Materials, Process and System..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Thareja, Gaurav ; Pal, Ashish ; Wang, Xingye... - p. 1-2 , 2023
 
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7

Material Innovation Through Atomistic Modelling for Hybrid ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Dag, Sefa ; Jiang, Liu ; Lianto, Prayudi... - p. 522-526 , 2022
 
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8

MOL Local Interconnect Innovation: Materials, Process & Sys..:

, In: 2022 International Electron Devices Meeting (IEDM),
Pal, Ashish ; Thareja, Gaurav ; Dag, Sefa... - p. 12.6.1-12.6.4 , 2022
 
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9

A Holistic Development Framework for Hybrid Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sitaraman, Srikrishna ; Jiang, Liu ; Dag, Sefa... - p. 691-700 , 2022
 
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