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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
11
Modeling Effect of Underfill Property Evolution on the FCBG..:
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2022 IEEE Frontiers in Education Conference (FIE) ,
13
The Role of Community in Promoting Engineering Identity For..:
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
15