Davis, Robin L
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2

600mm x 600mm Fan-Out Panel Level Package (FOPLP) as an Alt..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lim, Jacinta Aman ; Lee, Jane ; Shin, Hyun-Jin... - p. 16-22 , 2024
 
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Exploring the Potential of Geopolymer Binders: A Study on B..:

Subramanian, Saravanan ; Davis, Robin ; Thomas, Blessen Skariah
Iranian Journal of Science and Technology, Transactions of Civil Engineering.  , 2024
 
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2018 Kerala Flood Damage: Survey, Identification, and Damag..:

Anisha, A. ; Malavika, K. ; Erfana, K....
ASCE OPEN: Multidisciplinary Journal of Civil Engineering.  1 (2023)  - p. , 2023
 
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Seismic Assessment of Vertical Geometric Irregular Building..:

Zade, Nikhil P. ; Sarkar, Pradip ; Davis, Robin
Iranian Journal of Science and Technology, Transactions of Civil Engineering.  47 (2022)  4 - p. 2247-2262 , 2022
 
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