De Keersgieter, A.
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2

On The Contribution of Secondary Holes in Hot-Carrier Degra..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Tyaginov, S.E. ; Bury, E. ; Grill, A.... - p. 1-3 , 2023
 
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3

Backside Power Delivery: Game Changer and Key Enabler of Ad..:

, In: 2023 International Electron Devices Meeting (IEDM),
Veloso, A. ; Vermeersch, B. ; Chen, R.... - p. 1-4 , 2023
 
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4

Nanosheet-based Complementary Field-Effect Transistors (CFE..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Mertens, H. ; Hosseini, M. ; Chiarella, T.... - p. 1-2 , 2023
 
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6

Nanosheet-based Device Architectures with Front/Backside Co..:

, In: 2023 21st International Workshop on Junction Technology (IWJT),
Veloso, A. ; Eneman, G. ; Matagne, P.... - p. 1-5 , 2023
 
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7

Physica status solidi 

Volume 130, Number 1: July 1  Physica status solidi ; Volume 130, Number 1, B
Alberts, H. L ; Alybakov, A. A ; Anastassakis, E... - Reprint 2021 . , [2022]
 
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8

Insights into Scaled Logic Devices Connected from Both Wafe..:

, In: 2022 International Electron Devices Meeting (IEDM),
Veloso, A. ; Eneman, G. ; Matagne, P.... - p. 23.3.1-23.3.4 , 2022
 
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9

Innovations in Transistor Architecture and Device Connectiv..:

, In: 2022 International Conference on IC Design and Technology (ICICDT),
Veloso, A. ; Eneman, G. ; De Keersgieter, A.... - p. 51-54 , 2022
 
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Scaled FinFETs Connected by Using Both Wafer Sides for Rout..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Veloso, A. ; Jourdain, A. ; Radisic, D.... - p. 284-285 , 2022
 
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12

The impact of self-heating and its implications on hot-carr..:

Tyaginov, S. ; Makarov, A. ; Chasin, A....
Microelectronics Reliability.  122 (2021)  - p. 114156 , 2021
 
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14

Nanowire & Nanosheet Fets for Advanced Ultra-Scaled, High-D..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Veloso, A. ; Matagne, P. ; Eneman, G.... - p. 1-4 , 2020
 
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15

Physical Modeling the Impact of Self-Heating on Hot-Carrier..:

, In: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Tyaginov, S. ; Makarov, A. ; Chasin, A.... - p. 1-7 , 2020
 
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