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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Wafer Level Chip Scale Package Technology Applied to MEMS P..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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From MEMS Strip to MEMS Unit: a Comprehensive Simulation Ap..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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MEMS Mirror in Hermetic Package for Enhanced Performances:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Hybrid package for high performance Inertial Measurement Un..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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