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Deo, Karthik
9  results:
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1

Bond-line Thickness Prediction for Thermal Interface Materi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lai, Yangyang ; X, Jiefeng ; Ha, Jonghwan... - p. 1538-1542 , 2024
Link: https://doi.org/10.1109/..
 
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2

Reflow Oven Zone Temperature Advisor using the AI-Driven Sm..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lai, Yangyang ; Yin, Pengcheng ; Yang, Junbo... - p. 1773-1778 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Deep Learning Approach for Reflow Profile Prediction:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lai, Yangyang ; Kataoka, Jun ; Pan, Ke... - p. 2269-2274 , 2022
Link: https://doi.org/10.1109/..
 
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4

Characterization of Constitutive Equation of Sn-Bi by Study..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Cai, Chongyang ; Pan, Ke ; Deo, Karthik... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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5

Reliability of Differently Shaped Solder Joints in Chip Res..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ha, Jonghwan ; Deo, Karthik Arun ; Yang, Junbo.. - p. 1639-1643 , 2024
Link: https://doi.org/10.1109/..
 
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6

Influence of Stiffener Design on Co-Packaged Optics (CPO) 2..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Deo, Karthik Arun ; Lai, Yangyang ; Yang, Junbo.. - p. 1814-1819 , 2024
Link: https://doi.org/10.1109/..
 
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7

Reflow Recipe Establishment Based on CFD-Informed Machine L..:

Lai, Yangyang ; Ha, Jong Hwan ; Deo, Karthik Arun...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  1 - p. 127-134 , 2023
Link: https://doi.org/10.1109/..
 
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8

A Technical Review on State of the Art In-Plane and Out-of-..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Deo, Karthik Arun ; Yin, Pengcheng ; Yang, Junbo.. - p. 907-913 , 2023
Link: https://doi.org/10.1109/..
 
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9

Influence of Copper Pad Dimension on Thermal Fatigue Life P..:

Arun Deo, Karthik ; Park, Seungbae ; Kono, Raymond-Noel
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1388-1398 , 2023
Link: https://doi.org/10.1109/..
 
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