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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Bond-line Thickness Prediction for Thermal Interface Materi..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Reflow Oven Zone Temperature Advisor using the AI-Driven Sm..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
A Deep Learning Approach for Reflow Profile Prediction:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
4
Characterization of Constitutive Equation of Sn-Bi by Study..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
5
Reliability of Differently Shaped Solder Joints in Chip Res..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Influence of Stiffener Design on Co-Packaged Optics (CPO) 2..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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