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Derakhshandeh, Jaber
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1

Process Development and Characterization of Ru-based UBM fo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tulzo, Harold Le ; Bijou, Diane ; Souza, Therese... - p. 378-385 , 2024
Link: https://doi.org/10.1109/..
 
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2

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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3

Chemical mechanical polishing for indium bond pad damascene..:

Ceulemans, Karl ; Shafahian, Ehsan ; Struyf, Herbert...
Japanese Journal of Applied Physics.  63 (2024)  3 - p. 03SP39 , 2024
Link: https://doi.org/10.35848..
 
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4

Plasma Cleaning and Thermal Compression Bonding of Indium B..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kang, Kumin ; Derakhshandeh, Jaber ; Wendeln, Christian... - p. 267-268 , 2024
Link: https://doi.org/10.23919..
 
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5

Wet Cu passivation for high throughput fluxless Thermal Com..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Rip, Jens ; Derakhshandeh, Jaber ; Negishi, Ryo... - p. 1859-1862 , 2024
Link: https://doi.org/10.1109/..
 
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6

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024
Link: https://doi.org/10.1109/..
 
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7

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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8

IP Session on Chiplet: Design, Assembly, and Test:

, In: 2023 IEEE 41st VLSI Test Symposium (VTS),
Vinnakota, Bapi ; Derakhshandeh, Jaber ; Beyne, Eric.. - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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9

Process Challenges During CVD Oxide Deposition on the Backs..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Guerrero, Alice ; Salahouelhadj, Abdellah... - p. 1584-1589 , 2023
Link: https://doi.org/10.1109/..
 
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10

Developing TSV wet cleaning chemistry for quantum computing..:

Le Tulzo, Harold ; Celeste, Loriana ; Tendero, Inès...
Microelectronic Engineering.  276 (2023)  - p. 112010 , 2023
Link: https://doi.org/10.1016/..
 
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11

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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12

Electrochemical deposition of indium from chloride bath for..:

Park, Kimoon ; Inoue, Fumihiro ; Derakhshandeh, Jaber.
Japanese Journal of Applied Physics.  61 (2022)  4 - p. 041003 , 2022
Link: https://doi.org/10.35848..
 
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13

Fundamental study of IMC grains at low anneal temperature:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Gerets, Carine ; Derakhshandeh, Jaber ; Shafahian, Ehsan... - p. 133-134 , 2022
Link: https://doi.org/10.23919..
 
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14

Confined IMCs for low temperature and high throughput D2W b..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Derakhshandeh, Jaber ; La Tulipe, Douglas Charles ; Capuz, Giovanni... - p. 131-132 , 2022
Link: https://doi.org/10.23919..
 
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15

Fine-pitch bonding technology with surface-planarized solde..:

Inoue, Fumihiro ; Derakhshandeh, Jaber ; Lofrano, Melina.
Japanese Journal of Applied Physics.  60 (2021)  2 - p. 026502 , 2021
Link: https://doi.org/10.35848..
 
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