Deshpande, Sameer
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1

Characterization and Multiscale Modeling of TDDB in State-o..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Palmieri, Andrea ; Tavakoli, Mahdi ; Ching, Chi... - p. 10A.3-1-10A.3-6 , 2024
 
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BEOL Interconnect Innovation: Materials, Process and System..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Thareja, Gaurav ; Pal, Ashish ; Wang, Xingye... - p. 1-2 , 2023
 
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Tungsten Interconnect Resistance Reduction Enabling Energy ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Thareja, Gaurav ; Pal, Ashish ; Ma, Quan... - p. 1-4 , 2023
 
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10

An Integrative Literature Review of Interventions to Protec..:

Saleme, Pamela ; Seydel, Tori ; Pang, Bo..
International Journal of Environmental Research and Public Health.  20 (2023)  3 - p. 2145 , 2023
 
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11

Celebrating Lessons Learned from "Unsuccessful" Social Mark..:

Deshpande, Sameer
Social Marketing Quarterly.  28 (2022)  1 - p. 3-7 , 2022
 
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14

MOL Local Interconnect Innovation: Materials, Process & Sys..:

, In: 2022 International Electron Devices Meeting (IEDM),
Pal, Ashish ; Thareja, Gaurav ; Dag, Sefa... - p. 12.6.1-12.6.4 , 2022
 
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15

Understanding Factors to COVID-19 Vaccine Adoption in Gujar..:

Tolia, Viral ; Renin Singh, Rajkumar ; Deshpande, Sameer..
International Journal of Environmental Research and Public Health.  19 (2022)  5 - p. 2707 , 2022
 
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