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Deuk Min, Kyung
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1

Mechanical properties and microstructures of Cu/In-48Sn all..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kang, Dong Gil ; Deuk Min, Kyung ; Jung, Hak San... - p. 2206-2210 , 2022
Link: https://doi.org/10.1109/..
 
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2

Board Level Drop Reliability of Hybrid Solder Joints with C..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Seahwan ; Min, Kyung Deuk ; Jun Yoon, Jae.. - p. 1473-1478 , 2024
Link: https://doi.org/10.1109/..
 
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3

Proposal of intense pulsed light soldering process for impr..:

Min, Kyung Deuk ; Ha, Eun ; Lee, Sinyeob...
Journal of Manufacturing Processes.  98 (2023)  - p. 19-28 , 2023
Link: https://doi.org/10.1016/..
 
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4

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid ..:

Ha, Eun ; Min, Kyung Deuk ; Lee, Sinyeob...
Advanced Engineering Materials.  25 (2023)  10 - p. , 2023
Link: https://doi.org/10.1002/..
 
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5

Evaluation on bonding reliability of SAC305/Sn-57.5Bi-0.4Ag..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Oh, Geunsik ; Min, Kyung Deuk ; Ha, Eun. - p. 2230-2235 , 2022
Link: https://doi.org/10.1109/..
 
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6

RF Characterization in Range of 18GHz in Fan-out Package St..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ha, Eun ; Jeong, Haksan ; Min, Kyung Deuk.. - p. 2002-2007 , 2022
Link: https://doi.org/10.1109/..
 
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7

Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and ..:

Hwang, Byeong-Uk ; Jung, Kwang-Ho ; Min, Kyung Deuk..
Journal of Materials Science: Materials in Electronics.  32 (2021)  3 - p. 3054-3065 , 2021
Link: https://doi.org/10.1007/..
 
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8

Intense pulsed light surface treatment for improving adhesi..:

Kim, Jae-Ha ; Lee, Choong-Jae ; Min, Kyung Deuk...
Composite Structures.  258 (2021)  - p. 113364 , 2021
Link: https://doi.org/10.1016/..
 
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9

Hybrid transient liquid phase sintering bonding of Sn-3.0Ag..:

Min, Kyung Deuk ; Lee, Choong-Jae ; Hwang, Byeong-Uk...
Applied Surface Science.  551 (2021)  - p. 149396 , 2021
Link: https://doi.org/10.1016/..
 
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10

Enhancement of electrochemical and thermal bonding reliabil..:

Min, Kyung Deuk ; Jung, Kwang-Ho ; Lee, Choong-Jae..
Journal of Alloys and Compounds.  857 (2021)  - p. 157595 , 2021
Link: https://doi.org/10.1016/..
 
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11

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstru..:

Jang, Jun-Ho ; Min, Kyung Deuk ; Lee, Choong-Jae..
Journal of Electronic Materials.  50 (2021)  10 - p. 5639-5646 , 2021
Link: https://doi.org/10.1007/..
 
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12

Fabrication of an IPL-sintered Cu circuit and its electroch..:

Lee, Choong-Jae ; Kang, Dong-Gil ; Hwang, Byeong-Uk...
Journal of Alloys and Compounds.  863 (2021)  - p. 158726 , 2021
Link: https://doi.org/10.1016/..
 
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13

Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pul..:

Jung, Kwang-Ho ; Min, Kyung Deuk ; Lee, Choong-Jae...
Advanced Engineering Materials.  22 (2020)  12 - p. , 2020
Link: https://doi.org/10.1002/..
 
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14

Mechanical reliability of Cu cored solder ball in flip chip..:

Jeong, Haksan ; Min, Kyung Deuk ; Lee, Choong-Jae..
Microelectronics Reliability.  112 (2020)  - p. 113918 , 2020
Link: https://doi.org/10.1016/..
 
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15

Fabrication of Novel Ag Flake Composite Films Using a CMC/P..:

Lee, Choong-Jae ; Hwang, Byeong-Uk ; Jeong, Haksan..
Electronic Materials Letters.  16 (2020)  4 - p. 332-339 , 2020
Link: https://doi.org/10.1007/..
 
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