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Di Lee, Wen
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1

A Rare Case of Persistent Multifocal Cribriform-Morular Thy..:

Kuenstner, William ; Zhao, Po ; Lee, Wen...
AACE Clinical Case Reports.  10 (2024)  2 - p. 63-66 , 2024
Link: https://doi.org/10.1016/..
 
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2

Optimization of the CMP process for direct wafer-to-wafer o..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ji, Hong-Miao ; Cheemalamarri, Hemanth Kumar ; Chi, Ting-Ta... - p. 421-424 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Novel Packaging Solution for Photonic Engine Application:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Feng, Xu ; Zhenyu, Li ; Lee, Wen - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

Separation of electric and thermal transport with in-situ p..:

Wang, Wenxuan ; Liu, Yichen ; Xue, Yifan...
Acta Materialia.  260 (2023)  - p. 119347 , 2023
Link: https://doi.org/10.1016/..
 
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5

Objective multidisciplinary measurements of sleep disturban..:

Lee, Wen ; Li, Yi-Lu ; Li, Chung-Yi..
Journal of the Formosan Medical Association.  122 (2023)  6 - p. 470-478 , 2023
Link: https://doi.org/10.1016/..
 
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6

Severe re-expansion pulmonary edema after minimally invasiv..:

Lizwan, Marco ; Lee, Wen Di ; Chong, Jia Jie.
JTCVS Techniques.  21 (2023)  - p. 78-82 , 2023
Link: https://doi.org/10.1016/..
 
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7

Cu and barrier CMP process development with fine 1μm Cu bon..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Roy, Sangita Chaki ; Guan, Chen Gim ; Venkataraman, Nandini.. - p. 135-138 , 2023
Link: https://doi.org/10.1109/..
 
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8

The laser cavity electric connection line with SnAg solder ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chi, Ting Ta ; Li, Zhenyu ; Yu, Haitao... - p. 12-15 , 2023
Link: https://doi.org/10.1109/..
 
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9

A Novel Structure of Multi-Mode Interferometer with Low Exc..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhenyu, Li ; Shuyi, Li ; Wei, Luo.. - p. 809-812 , 2023
Link: https://doi.org/10.1109/..
 
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10

Laser integration on a photonic integrated circuit with hig..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chi, Ting Ta ; Li, Zhenyu ; Li, Nanxi... - p. 1880-1884 , 2023
Link: https://doi.org/10.1109/..
 
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11

Study of Cu Pad Expansion with Surrounding Dielectrics for ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Cheemalamarri, Hemanth Kumar ; Lir, Ji ; Lee, Wen.. - p. 493-497 , 2023
Link: https://doi.org/10.1109/..
 
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12

Laser Integration on Silicon through Flip-chip Bonding with..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chi, Ting Ta ; Li, Nanxi ; Cai, Hong... - p. 138-141 , 2022
Link: https://doi.org/10.1109/..
 
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13

Nonseminomatous Germ-Cell Tumor Presenting as Bilateral Adr..:

Baral, Neelam ; Bansal, Rashika ; Basyal, Binaya...
AACE Clinical Case Reports.  7 (2021)  1 - p. 43-46 , 2021
Link: https://doi.org/10.1016/..
 
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14

Do Molecular Profiles of Primary Versus Metastatic Radioiod..:

Gomes-Lima, Cristiane J. ; Shobab, Leila ; Wu, Di...
Frontiers in Endocrinology.  12 (2021)  - p. , 2021
Link: https://doi.org/10.3389/..
 
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15

Protein-protected gold/silver alloy nanoclusters in metal-e..:

Yu, Yong ; Lee, Wen Di ; Tan, Yen Nee
Materials Science and Engineering: C.  109 (2020)  - p. 110525 , 2020
Link: https://doi.org/10.1016/..
 
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