Djuric-Rissner, Tatjana
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Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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6

Characterization of laser-welded structures in glass using ..:

Seker, N. ; Benz, E. ; Schuhmacher, S....
Practical Metallography.  59 (2022)  8-9 - p. 520-531 , 2022
 
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