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1

Effect of Sub-Surface Damage Layer Removal by Sublimation E..:

Dojima, Daichi ; Maki, Mizuho ; Dansako, Daichi..
Solid State Phenomena. 343 (2023) - p. 29-36 , 2023

Link: https://doi.org/10.4028/..

2

4H-SiC Full Wafer Mapping Image of CMP-Finished Sub-Surface..:

Dojima, Daichi ; Dansako, Daichi ; Maki, Mizuho..
Solid State Phenomena. 343 (2023) - p. 43-50 , 2023

Link: https://doi.org/10.4028/..

3

Suppression of In-Grown SF Formation and BPD Propagation in..:

Toda, Kohei ; Dojima, Daichi ; Kojima, Kiyoshi...
Solid State Phenomena. 344 (2023) - p. 9-14 , 2023

Link: https://doi.org/10.4028/..

4

A Novel Approach of Utilizing Mechanically Flexible SiC Sub..:

Dojima, Daichi ; Matsubara, Moeko ; Minamiyama, Hideaki.
Materials Science Forum. 1062 (2022) - p. 28-32 , 2022

Link: https://doi.org/10.4028/..

5

Evaluation of diamond mosaic wafer crystallinity by electro..:

Matsushita, Akio ; Fujimori, Naoji ; Tsuchida, Yuki...
Diamond and Related Materials. 101 (2020) - p. 107558 , 2020

Link: https://doi.org/10.1016/..

6

Evaluation of growth sector orientation changes of high B d..:

Matsushita, Akio ; Tsuchida, Yuki ; Matsuoka, Minori...
Japanese Journal of Applied Physics. 58 (2019) 6 - p. 065504 , 2019

Link: https://doi.org/10.7567/..

7

In-situ growth mode control of AlN on SiC substrate by subl..:

Dojima, Daichi ; Ashida, Koji ; Kaneko, Tadaaki
Journal of Crystal Growth. 483 (2018) - p. 206-210 , 2018

Link: https://doi.org/10.1016/..

8

Rearrangement of Surface Structure of 4o Off-Axis 4H-SiC (0..:

Ashida, Koji ; Dojima, Daichi ; Torimi, Satoshi...
Materials Science Forum. 924 (2018) - p. 249-252 , 2018

Link: https://doi.org/10.4028/..

9

Evaluation of Polishing-Induced Subsurface Damage of 4H-SiC..:

Ashida, Koji ; Dojima, Daichi ; Kutsuma, Yasunori...
MRS Advances. 1 (2016) 55 - p. 3697-3702 , 2016

Link: https://doi.org/10.1557/..

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