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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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A Board Level Vibration Test Method for Electronic Industry..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A New Vibration Test Method for Automotive and Consumer Ele..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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New Methodology Assessment of Copper Trace and Solder Joint..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Solder Joint Fatigue Studies Subjected to Board-level Rando..:
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2022 IEEE 67th Holm Conference on Electrical Contacts (HLM) ,
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