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Du, Xiangbin
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1

An adaptive thermal management method via bionic sweat pore..:

Yu, Lihang ; Jiao, Binbin ; Ye, Yuxin...
Applied Thermal Engineering.  247 (2024)  - p. 122953 , 2024
Link: https://doi.org/10.1016/..
 
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2

Near-Junction Thermal Management of GaN-on-SiC MMIC Power A..:

Lu, Dichen ; Ye, Yuxin ; Liu, Ruiwen...
IEEE Transactions on Electron Devices.  71 (2024)  1 - p. 502-509 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Highly Sensitive Dual-Mode Thermal Flow Sensor Based on C..:

Qiao, Jingping ; Chen, Jingyu ; Jiao, Binbin...
IEEE Sensors Journal.  24 (2024)  2 - p. 1245-1254 , 2024
Link: https://doi.org/10.1109/..
 
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4

Investigation on the unconstrained microfluidic heat sink w..:

Yu, Lihang ; Ye, Yuxin ; Wang, Zhenyu...
Thermal Science.  28 (2024)  2 Part A - p. 877-888 , 2024
Link: https://doi.org/10.2298/..
 
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5

Low Stress TSV Arrays for High-Density Interconnection:

Jiao, Binbin ; Qiao, Jingping ; Jia, Shiqi...
Engineering.  , 2024
Link: https://doi.org/10.1016/..
 
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6

Experimental investigations of manifold structure on coolin..:

, In: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Li, Wei ; Ye, Yuxin ; Yan, Yingzhan... - p. 120-123 , 2023
Link: https://doi.org/10.1109/..
 
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7

Experimental Investigations on Thermal Superposition Effect..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Ye, Yuxin ; Du, Xiangbin ; Kong, Yanmei... - p. 1017-1021 , 2023
Link: https://doi.org/10.1109/..
 
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8

Numerical investigation on tensile behavior of three-dimens..:

Du, Xiang-bin ; Li, Dian-sen ; Jiang, Lei.
International Journal of Mechanical Sciences.  237 (2023)  - p. 107815 , 2023
Link: https://doi.org/10.1016/..
 
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9

A nanodiamond chemotherapeutic folate receptor-targeting pr..:

Wu, Jiangtao ; Du, Xiangbin ; Zhang, Dongmei...
International Journal of Pharmaceutics.  630 (2023)  - p. 122432 , 2023
Link: https://doi.org/10.1016/..
 
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10

A combined solution of thermoelectric coolers and microchan..:

Cong, Bo ; Kong, Yanmei ; Ye, Yuxin...
Applied Thermal Engineering.  219 (2023)  - p. 119370 , 2023
Link: https://doi.org/10.1016/..
 
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11

Low-stress TSVs for high-density 3D integration:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Qiao, Jingping ; Jiao, Binbin ; Jia, Shiqi... - p. 606-611 , 2023
Link: https://doi.org/10.1109/..
 
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12

Embedded manifold cooling for efficient thermal management ..:

, In: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Du, Xiangbin ; Ye, Yuxin ; Kong, Yanmei... - p. 209-212 , 2023
Link: https://doi.org/10.1109/..
 
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13

Multi-scale analysis of compressive behavior of 3D five-dir..:

Zhu, Hao ; Han, Meng ; Du, Xiang-bin...
European Journal of Mechanics - A/Solids.  98 (2023)  - p. 104885 , 2023
Link: https://doi.org/10.1016/..
 
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14

Investigation on the heat dissipation of high heat flux chi..:

Cong, Bo ; Liu, Ruiwen ; Ye, Yuxin...
Thermal Science.  27 (2023)  1 Part B - p. 869-880 , 2023
Link: https://doi.org/10.2298/..
 
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15

Investigation of parameterized braiding parameters and load..:

Zhu, Hao ; Du, Xiang-bin ; Li, Dian-sen.
Composite Structures.  287 (2022)  - p. 115357 , 2022
Link: https://doi.org/10.1016/..
 
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