Ekere, Ndy
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1

Effects of Reflow Profile and Miniaturisation on the Integr..:

Njoku, Jude E. ; Amalu, Emeka H. ; Ekere, Ndy...
Journal of Electronic Materials.  52 (2023)  6 - p. 3786-3796 , 2023
 
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3

Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder ..:

Kumar, Santosh ; Mallik, Sabuj ; Ekere, Ndy.
Metals and Materials International.  19 (2013)  5 - p. 1083-1090 , 2013
 
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4

Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder P..:

Mallik, Sabuj ; Chan, Erica Hiu Laam ; Ekere, Ndy
Journal of Materials Engineering and Performance.  22 (2012)  4 - p. 1186-1193 , 2012
 
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5

Investigation of thermal management materials for automotiv..:

Mallik, Sabuj ; Ekere, Ndy ; Best, Chris.
Applied Thermal Engineering.  31 (2011)  2-3 - p. 355-362 , 2011
 
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6

High temperature reliability of lead-free solder joints in ..:

Amalu, Emeka H. ; Ekere, Ndy N.
Journal of Materials Processing Technology.  212 (2012)  2 - p. 471-483 , 2012
 
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7

Prediction of damage and fatigue life of high-temperature f..:

Amalu, Emeka H. ; Ekere, Ndy N.
Microelectronics Reliability.  52 (2012)  11 - p. 2731-2743 , 2012
 
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8

Intermetallic phase detection in lead-free solders using sy..:

Jackson, Gavin J. ; Lu, Hua ; Durairaj, Raj...
Journal of Electronic Materials.  33 (2004)  12 - p. 1524-1529 , 2004
 
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11

Investigation of Thermal Management Materials for Automotiv..:

Mallik, Sabuj ; Ekere, Ndy ; Best, Chris.
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.applthermaleng.2010.09.023.  , 2010
 
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