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2024 International Conference on Electronics Packaging (ICEP) ,
10
Plasma Cleaning and Thermal Compression Bonding of Indium B..:
, In:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
12
ELD NiB for microbumps passivation and wirebonding:
, In:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
13