Engel, C
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2

Process Innovations for Future Technology Nodes with Back-S..:

, In: 2023 International Electron Devices Meeting (IEDM),
Kobrinsky, M. ; Silva, J. D ; Mannebach, E.... - p. 1-4 , 2023
 
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4

Abstract No. 570 Minimally Invasive Interventional Radiolog..:

Gu, K. ; DePalma, A. ; Keshishian, E....
Journal of Vascular and Interventional Radiology.  34 (2023)  3 - p. S161 , 2023
 
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5

Novel Cell Architectures with Back-side Transistor Contacts..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kobrinsky, M. ; Silva, J. D ; Mannebach, E.... - p. 1-2 , 2023
 
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9

FeRAM using Anti-ferroelectric Capacitors for High-speed an..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chang, S. -C. ; Haratipour, N. ; Shivaraman, S.... - p. 33.2.1-33.2.4 , 2021
 
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10

Guidelines for Climate Change Adaptation in Brazilian Citie..:

Almeida, J ; Engel, C
IOP Conference Series: Earth and Environmental Science.  503 (2020)  1 - p. 012036 , 2020
 
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12

CONCEPTION OF A DIGITAL TWIN IN MECHANICAL ENGINEERING – A ..:

Schweigert-Recksiek, S. ; Trauer, J. ; Engel, C...
Proceedings of the Design Society: DESIGN Conference.  1 (2020)  - p. 383-392 , 2020
 
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13

An End-to-End Solution for Automatic Contouring of Tumor Re..:

, In: 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Gerolami, J. ; Wu, V. ; Fauerbach, P. Nasute.... - p. 2003-2006 , 2020
 
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14

WHAT IS A DIGITAL TWIN? – DEFINITIONS AND INSIGHTS FROM AN ..:

Trauer, J. ; Schweigert-Recksiek, S. ; Engel, C...
Proceedings of the Design Society: DESIGN Conference.  1 (2020)  - p. 757-766 , 2020
 
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15

Daylighting Analysis: A Contribution to the Urban Planning ..:

Drago, K ; Brunoro, S ; Engel, C
IOP Conference Series: Earth and Environmental Science.  503 (2020)  1 - p. 012082 , 2020
 
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