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Esmanhotto, E.
20  results:
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1

Bayesian In-Memory Computing with Resistive Memories:

, In: 2023 International Electron Devices Meeting (IEDM),
Turck, C. ; Bonnet, D. ; Harabi, K.-E.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Hardware calibrated learning to compensate heterogeneity in..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Moro, Filippo ; Esmanhotto, E. ; Hirtzlin, T.... - p. 380-383 , 2022
Link: https://doi.org/10.1109/..
 
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3

Novel Fine-Grain Back-Bias Assist Techniques for 14nm FDSOI..:

, In: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),
Bosch, D. ; Andrieu, F. ; Ciampolini, L.... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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4

Novel 1T2R1T RRAM-based Ternary Content Addressable Memory ..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Ly, D. R. B. ; Nowak, E. ; Vianello, E.... - p. 35.5.1-35.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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5

Reliability and Variability of 1S1R OxRAM-OTS for High Dens..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Robayo, D. Alfaro ; Deleruyelle, D. ; Vianello, E.... - p. 35.3.1-35.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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6

Experimental demonstration of Single-Level and Multi-Level-..:

Esmanhotto, E ; Hirtzlin, T ; Castellani, N...
http://arxiv.org/abs/2203.01680.  , 2022
Link: http://arxiv.org/abs/220..
 
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7

Hardware calibrated learning to compensate heterogeneity in..:

Moro, Filippo ; Esmanhotto, E ; Hirtzlin, T...
http://arxiv.org/abs/2202.05094.  , 2022
Link: http://arxiv.org/abs/220..
 
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8

High-Density 3D Monolithically Integrated Multiple 1T1R Mul..:

Esmanhotto, E ; Brunet, L ; Castellani, N...
info:eu-repo/semantics/altIdentifier/doi/10.1109/IEDM13553.2020.9372019.  , 2020
Link: https://hal.science/hal-..
 
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9

High-Density 3D Monolithically Integrated Multiple 1T1R Mul..:

Esmanhotto, E ; Brunet, L ; Castellani, N...
info:eu-repo/semantics/altIdentifier/doi/10.1109/IEDM13553.2020.9372019.  , 2020
Link: https://hal.science/hal-..
 
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10

High-Density 3D Monolithically Integrated Multiple 1T1R Mul..:

Esmanhotto, E ; Brunet, L ; Castellani, N...
info:eu-repo/semantics/altIdentifier/doi/10.1109/IEDM13553.2020.9372019.  , 2020
Link: https://hal.science/hal-..
 
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11

High-Density 3D Monolithically Integrated Multiple 1T1R Mul..:

Esmanhotto, E ; Brunet, L ; Castellani, N...
info:eu-repo/semantics/altIdentifier/doi/10.1109/IEDM13553.2020.9372019.  , 2020
Link: https://hal.science/hal-..
 
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12

High-Density 3D Monolithically Integrated Multiple 1T1R Mul..:

Esmanhotto, E ; Brunet, L ; Castellani, N...
info:eu-repo/semantics/altIdentifier/doi/10.1109/IEDM13553.2020.9372019.  , 2020
Link: https://hal.archives-ouv..
 
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13

High-Density 3D Monolithically Integrated Multiple 1T1R Mul..:

Esmanhotto, E ; Brunet, L ; Castellani, N...
info:eu-repo/semantics/altIdentifier/doi/10.1109/IEDM13553.2020.9372019.  , 2020
Link: https://hal.science/hal-..
 
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14

Novel Fine-Grain Back Bias Assist Techniques for 14 nm FDSO..:

Bosch, D ; Andrieu, François ; Ciampolini, Lorenzo...
hal-02015950.  , 2019
Link: https://hal.science/hal-..
 
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15

Novel Fine-Grain Back Bias Assist Techniques for 14 nm FDSO..:

Bosch, D ; Andrieu, François ; Ciampolini, Lorenzo...
hal-02015950.  , 2019
Link: https://hal.science/hal-..
 
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