Eu, Ong. Kang
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1

Predictive Modelling Methodologies for Bi-material Strip Wa..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Wang, Jenn An ; Eu, Ong. Kang ; Weng, Wen Hsin... - p. 72-75 , 2020
 
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2

Optimization of fins used in electronic packaging:

Eu Ong, Kang ; Oon Lee, Kor ; Seetharamu, K.N....
Microelectronics International.  22 (2005)  1 - p. 10-15 , 2005
 
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3

Industry Drop Tests in Solder Joint Reliability Study of Mo..:

, In: 2006 International Conference on Electronic Materials and Packaging,
Ong, Kang Eu ; Loh, Wei Keat ; Wong, Chee Wai... - p. None , 2006
 
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4

Thin-film composite tri-bore hollow fiber (TFC TbHF) membra..:

Hua, Dan ; Kang Ong, Yee ; Wang, Peng.
Journal of Membrane Science.  471 (2014)  - p. 155-167 , 2014
 
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5

Soft TQM, agility, and knowledge management deliver organiz..:

Ong, Eu Chin ; Tan, Cheng Ling
Global Business and Organizational Excellence.  41 (2022)  4 - p. 28-47 , 2022
 
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6

Influence of landscape matrix on urban bird abundance: evid..:

Puan, Chong Leong ; Yeong, Kok Loong ; Ong, Kang Woei...
Journal of Asia-Pacific Biodiversity.  12 (2019)  3 - p. 369-375 , 2019
 
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7

The key is ownership of agility:

Ong, Eu Chin ; Tan, Cheng Ling ; Amran, Azlan
Strategic Direction.  35 (2019)  1 - p. 9-12 , 2019
 
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15

Interfacial design towards stable zinc metal-free zinc-ion ..:

Xiong, Ting ; Zhang, Deqiang ; Yeo, Jing Ying...
Journal of Materials Chemistry A.  12 (2024)  9 - p. 5499-5507 , 2024
 
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