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Eunkyung Kim, Sarah
2043  results:
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1

Fabrication of multilayer Graphene-coated Copper nanopartic..:

Shin, Dongho ; Choi, Sungjun ; Eunkyung Kim, Sarah...
Applied Surface Science.  583 (2022)  - p. 152488 , 2022
Link: https://doi.org/10.1016/..
 
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2

Effects of two-step plasma treatment on Cu and SiO2 surface..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Seo, Han Kyeol ; Eunkyung Kim, Sarah ; Kim, Gahui.. - p. 1677-1683 , 2020
Link: https://doi.org/10.1109/..
 
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3

Development of CMOS-Compatible Low Temperature Cu Bonding O..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Park, Haesung ; Park, Manseok ; Seo, Han Kyeol. - p. 1474-1479 , 2020
Link: https://doi.org/10.1109/..
 
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4

Effect of radio frequency power on the properties of p-type..:

Um, Joseph ; Roh, Byeong-Min ; Kim, Sungdong.
Materials Science in Semiconductor Processing.  16 (2013)  6 - p. 1679-1683 , 2013
Link: https://doi.org/10.1016/..
 
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5

Two-Step Ar/N₂ Plasma Treatment on SiO₂ Surface for Cu/SiO₂..:

Park, Sangwoo ; Lee, Sangmin ; Kim, Sarah Eunkyung
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 723-728 , 2024
Link: https://doi.org/10.1109/..
 
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6

Optimization of O2 Plasma Treatment on Cu Surface for Hybri..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Park, Sangwoo ; Lee, Sangmin ; Choi, Junyoung. - p. 303-304 , 2024
Link: https://doi.org/10.23919..
 
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7

Thermal Transport Properties of Hybrid Bonding With Passiva..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Hakjun ; Hwang, Jae Young ; Park, Sangwoo... - p. 1609-1612 , 2024
Link: https://doi.org/10.1109/..
 
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8

Unraveling diffusion behavior in Cu-to-Cu direct bonding wi..:

Jeong, Min Seong ; Park, Sang Woo ; Kim, Yeon Ju...
Scientific Reports.  14 (2024)  1 - p. , 2024
Link: https://doi.org/10.1038/..
 
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9

Fly Cutting for Polymer Planarization in Hybrid Cu Bonding:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jang, Suin ; Lee, Sangmin ; Park, Sangwoo. - p. 307-308 , 2024
Link: https://doi.org/10.23919..
 
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10

Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Choi, Junyoung ; Lee, Sangmin ; Park, Sangwoo. - p. 305-306 , 2024
Link: https://doi.org/10.23919..
 
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11

First Demonstration of Enhanced Cu-Cu Bonding at Low Temper..:

Park, Sang Woo ; Hong, Seul Ki ; Kim, Sarah Eunkyung.
IEEE Access.  12 (2024)  - p. 82396-82401 , 2024
Link: https://doi.org/10.1109/..
 
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12

Effect of Evaporated and Sputtered Au Nanolayers on Cu Surf..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lee, Sangmin ; Park, Sangwoo ; Choi, Junyoung. - p. 299-300 , 2024
Link: https://doi.org/10.23919..
 
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13

Copper Bonding Technology in Heterogeneous Integration:

Lee, Yoon-Gu ; McInerney, Michael ; Joo, Young-Chang..
Electronic Materials Letters.  20 (2023)  1 - p. 1-25 , 2023
Link: https://doi.org/10.1007/..
 
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14

Compact, Flexible and Transparent Antenna Using MMF for Con..:

Nguyen, Tien Dat ; Kim, Sarah Eunkyung ; Jung, Chang Won
Journal of Electrical Engineering & Technology.  18 (2023)  6 - p. 4341-4352 , 2023
Link: https://doi.org/10.1007/..
 
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15

Thermomechanical Challenges of 2.5-D Packaging: A Review of..:

Kim, Hakjun ; Hwang, Jae Young ; Kim, Sarah Eunkyung..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  10 - p. 1624-1641 , 2023
Link: https://doi.org/10.1109/..
 
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