Liu, Dong ; Francis, Daniel ; Faili, Firooz...
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Sun, Huarui ; Liu, Dong ; Pomeroy, James W...
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Sun, Huarui ; Pomeroy, James ; Baranyai, Roland...
Sun , H , Pomeroy , J , Baranyai , R , Francis , D , Faili , F , Twitchen , D J & Kuball , M 2016 , ' Temperature-Dependent Thermal Resistance of GaN-on-Diamond HEMT Wafers ' , IEEE Electron Device Letters , vol. 37 , no. 5 , pp. 621-624 . https://doi.org/10.1109/LED.2016.2537835.  , 2016

Simon, Roland B ; Anaya, Julian ; Faili, Firooz...
Simon , R B , Anaya , J , Faili , F , Balmer , R , Williams , G T , Twitchen , D J & Kuball , M H H 2016 , ' Effect of grain size of polycrystalline diamond on its heat spreading properties ' , Applied Physics Express , vol. 9 , no. 6 , 061302 . https://doi.org/10.7567/APEX.9.061302.  , 2016

Liu, Dong ; Sun, Huarui ; Pomeroy, James...
Liu , D , Sun , H , Pomeroy , J , Francis , D , Faili , F , Twitchen , D J & Kuball , M 2015 , ' GaN-on-Diamond Electronic Device Reliability : Mechanical and Thermo-Mechanical Integrity ' , Applied Physics Letters , vol. 107 , no. 25 , 251902 . https://doi.org/10.1063/1.4938002.  , 2015

Sun, Huarui ; Simon, Roland B ; Pomeroy, James W...
Sun , H , Simon , R B , Pomeroy , J W , Francis , D , Faili , F , Twitchen , D J & Kuball , M H H 2015 , ' Reducing GaN-on-diamond interfacial thermal resistance for high power transistor applications ' , Applied Physics Letters , vol. 106 , no. 11 , 111906 . https://doi.org/10.1063/1.4913430.  , 2015

Kuball, Martin ; Pomeroy, James W ; Calvo, Julian Anaya...
Kuball , M , Pomeroy , J W , Calvo , J A , Sun , H , Simon , R B , Francis , D , Faili , F , Twitchen , D , Rossi , S , Alomari , M , Kohn , E , Tóth , L & Pécz , B 2015 , Novel Thermal Management of GaN Electronics : Diamond Substrates . in ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels : Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays . vol. 3 , IPACK 2015-48145 , American Society of Mechanical Engineers (ASME) , ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ....  , 2015